Thermal conductive adhesive for chips, specifically silver adhesive for bonding aluminum heat sinks

What kind of adhesive is used to bond the chip to the aluminum heat sink?

Chip thermal and conductive silver adhesive

The customer is developing a mining machine product and needs to find a thermal conductive adhesive with good bonding performance

Customer application: bonding chips and aluminum heat sinks,

Chip size: 7 * 8mm

Thermal conductivity: The customer did not request it.

I hope it can solidify quickly. The adhesive has good aging resistance.

According to the detailed requirements of the customer, our company recommends the HanSi thermal conductive adhesive product with a thermal conductivity of 6.5W for chip use.

The characteristics of thermal conductive adhesive are strong adhesion, stable thermal conductivity, and easy curing It can be cured at room temperature or heated

Customer Product: MP3

Current issue: The customer needs to use ultrasonic welding to weld the structural components of the product. BGA short circuit phenomenon may occur.

The customer wishes to use bottom filling adhesive to protect the bottom solder ball.

Customer BGA size: 0.6MM * 0.6MM.

Number of tin balls; 150 of them.

Ball diameter: 0.4mm

Gap: 0.5mm

The customer has not used the relevant adhesive before Technical support is required