Various electromagnetic shielding materials such as adhesive free substrate conductive cloth, conductive sponge, conductive foam, conductive tape, electromagnetic shielding film, etc. are widely used in fields such as aerospace, 5G fine circuit boards, etc.

FPC (Flexible Circuit Board) mainly uses polyimide (PI) copper-clad laminate (FCCL) or polyester (PET) copper-clad laminate.Flexible copper-clad laminate (FCCL)There are two types of P, one is adhesive and the other is non adhesive.

For those with adhesive, the PI film is coated with adhesive and then bonded to the copper foil. There are two methods for adhesive free flexible copper-clad laminates. One is to use PI film as a carrier and immerse copper foil on its surface. The other method is to use copper foil as a carrier, coat liquid PI on the surface of the copper foil, and then cure it. The adhesive free substrate is relatively thin and cannot be distinguished on the surface. Only by performing slice analysis can it be distinguished.

Advanced Institute Technology is a manufacturer of adhesive free substrates, producing and selling various electromagnetic shielding materials such as adhesive free substrates, conductive cloth, conductive sponge, conductive foam, conductive tape, electromagnetic shielding film, etc., which are widely used in fields such as aerospace, robotics, mobile phones, automotive electronic displays, 5G fine circuit boards, etc.