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Company news

Hot cured high adhesive strength, reflow resistant, conductive adhesive for fingerprint recognition module

Time:2021-12-19Number:1727

Conductive silver adhesiveTS-0253TID-120 is a modified epoxy conductive adhesive that does not contain solvents and requires low-temperature storage (around 0 ℃). It can be used for large-area pressing of metals and target materials. The dispensing process is smooth and can also be operated using screen printing. Good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, certain flexibility, and excellent conductivity. 130 ℃ * 15 minutes
Purpose: Fingerprint recognition module.
Specialty: Smooth dispensing, smooth silk screen printing, excellent conductivity, high adhesive strength.

Pre curing characteristics

Items

Data

Remark

project

measured value

Preparation

Appearance

Silver

appearance

silver gray

Viscosity

10-15Pa·s

Brookfield 52Z ,5rpm

Viscosity

Specific gravity

3.13

Cup

proportion

Pycnometer

GB/T 13354-1992

Cure time

50-60minutes

120℃

Curing Time

Storage

3months

-5℃-5℃

Storage conditions

1days

25℃-30℃

 Characteristics after curing

Items

Data

Remark

project

measured value

Preparation

Pencil hardness

3H-6H

Hardness (pencil hardness)

Lap shear strength

22MPa

Glass/nickel plated copper sheet

shear strength

10mm/min

Peel strength

71N/25mm

Glass/nickel plated copper sheet

peelstrength

50mm/min

Volume resistivity

0.0003ΩNaN(410TS)

0.0003ΩNaN(450TS)

130℃*15min

Volume resistivity


导电银胶

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