How will silver paste, silver palladium paste, gold resin paste, and silver paste develop, and share the development trend with you

Since the invention of the world's first transistor in 1948, electronic technology has entered a new stage, namely the microelectronics technology stage. One of the fundamental and important materials in the entire microelectronics technology isPrecious metal electronic pasteAlso known as thick film paste. Precious metal electronic paste plays a crucial role in the manufacturing process of electronic devices. It is usually uniformly coated onto the surface of the device using screen printing, and then dried, sintered (cured), and formed into a dense film layer. The thickness of the printing brush is easy to control, and it can print composite precious metals or multiple layers of precious metals. Therefore, precious metal electronic paste technology is an important component of modern electronic technology. Silver paste is an important and highly demanded type of electronic paste. Silver paste is usually composed of silver powder, inorganic additives, and organic carriers.. Silver paste can be divided into solidified silver paste (≤ 300 ℃) and sintered silver paste (≥ 500 ℃) according to usage conditions.

Curing silver paste silver adhesiveSilver palladium pasteGold resin paste silver paste is usually composed of conductive phase, organic resin, organic solvent, and additives. It is screen printed (coated) on a substrate, cured at a certain temperature, solvent evaporates, resin adheres to the substrate, and forms a conductive network to make the circuit conductive. The main process flow for preparing solidified silver paste is as follows:

Due to the continuous rise in silver prices, restrictions on specific materials, the application of nanotechnology, and the requirement for lead-free electronic products, new technologies for silver paste are constantly evolving towards low-temperature, thin-layer, and lead-free directions. Silver powder is an important basic material for preparing silver paste, and the various properties of the prepared silver powder directly affect the performance indicators of the obtained silver paste. Generally, the silver powder used for preparing silver paste mainly includes flake silver powder and ultrafine silver powder. The commonly used methods for preparing ultrafine silver powder include chemical reduction, thermophysical method, and thermophysical chemical method. Flake silver powder is usually prepared by mechanical processing on the basis of ultrafine silver powder, and can also be prepared by chemical reduction and electrolysis methods. In the preparation of silver paste, the purity, impurity content, and powder characteristics (such as specific surface area, density, particle size, particle size distribution, and morphology) of silver powder should be strictly controlled.

Due to the limitations of substrate usage conditions and energy-saving requirements,silver pasteTowards low-temperature development. The temperature for low-temperature curing is getting lower and lower, even reaching room temperature curing and UV curing. And these curing conditions are mainly determined by resin and solvent, except for silver powder. The continuous introduction of new technologies in chemical resin materials and solvent materials has promoted the development of low-temperature silver paste technology.