The use of conductive silver paste, silver palladium silver platinum paste in the production of LCD panels

　　Conductive silver pasteMain applications: It has the characteristics of low curing temperature, extremely high bonding strength, stable electrical performance, and is suitable for screen printing. Suitable for conductive and thermal bonding in ambient temperature curing welding applications, such as quartz crystals, infrared pyroelectric detectors, piezoelectric ceramics, potentiometers, flash lamps, as well as shielding and circuit repairs. It can also be used for conductive bonding in the wireless instrument industry; It can also replace solder paste to achieve conductive bonding.

Silver conductive paste is divided into two categories: ①Polymer silver conductive paste(Drying or curing to form a film, using organic polymers as the bonding phase); ②Sintered silver conductive paste(Sintering into film, sintering temperature>500 ℃, glass powder or oxide as bonding phase). Silver powder is classified based on particle size, with an average particle size of less than 0.1 μ m (100nm) classified as nano silver powder; 0.1 μ m<Dav (average particle size) 10.0 μ m is coarse silver powder. The three categories that make up silver conductor paste require different types of silver powder or combinations as conductive fillers, and even different formulations in each category require different silver powders as conductive functional materials. The purpose is to achieve the maximum utilization of silver conductivity and thermal conductivity with the least amount of silver powder under a determined formulation or film-forming process, which is related to the optimization of film performance and cost.

UV cured high resistance screen printed green insulation ink. Has excellent adhesion, high flexibility, good printing performance, and UV curing fast drying characteristics. Suitable for computer keyboard circuits, electrical film switches, RFID antennas, and printed electrodes. It has good adhesion to various substrates such as PET, polyester fibers, and plastic films. No need to add diluent, can be used after opening the can. Its colloid is 100% solid and does not contain any solvent components.

Product features: High resistance value, solvent-free, strong adhesion, superior flexibility, fast curing, long working time, excellent screen printing performance

Application instructions: The wet film thickness during screen printing can be set to 0.5-0.7 mil, printed in two batches, and the cured film thickness is 1.0-1.5 mil;

Typical screen printing equipment typically uses 180-220 mesh polyester screen with a coating thickness of 1.0 mil; For thicker film layers, steel mesh printing can be used;

Cleaning method: M.E.K (methyl ethyl ketone) can be used for cleaning, and the cured film layer can also be cleaned with corresponding solvents. Silk screen printing equipment should be dried before printing to avoid scratching and swelling. It is recommended to use solvent resistant materials such as polyurethane, and higher hardness rubber scrapers will have better printing effects