What are plastic, glass, ceramic conductive silver paste and where are they applied

Glue is needed in daily life, and each industry has its own specialized glue. Wood has wood glue, shoes have shoe glue, and learning uses another type of glue. What the editor is going to talk about below is the glue used in the electronics industry, calledConductive silver pasteWhen it comes to this name, we may not even know what it is. Although it is not easy to see conductive silver paste in our daily lives, this thing can affect our lives. It is applied in the fields of electronics or chemical engineering, and Advanced Institute of Technology will analyze it in detail hereConductive silver paste.

Conductive silver paste refers to silver paste printed on conductive substrates, which has the ability to conduct current and eliminate accumulated static charges. It is generally printed on non-conductive substrates such as plastic, glass, ceramics, or cardboard. There are a wide range of printing methods, such as screen printing, relief printing, flexographic printing, gravure printing, and flatbed printing, which can all be used. Different printing methods can be selected according to the requirements of film thickness, and the resistance, solder resistance, and friction resistance also vary depending on the film thickness. This silver paste comes in two types: thick film color paste and resin type. The former is a high-temperature firing process using glass material as a binder, while the latter is a low-temperature drying or radiation (UV, EB) process using synthetic resin as a binderCuring type wire mesh silver paste.

Conductive silver paste is composed of conductive fillers, adhesives, solvents, and additives. Conductive fillers use silver powder and copper powder with good conductivity, and sometimes gold powder, graphite, carbon black (now there are specialized conductive carbon black), carbon fiber, nickel powder, etc. Synthetic resins used as adhesives include epoxy resin, alkyd resin, acrylic resin, polyurethane resin, melamine formaldehyde resin, phenolic resin, vinyl chloride vinyl acetate copolymer resin, etc. The volume is the medium boiling point (120-230'C) solvent used to dissolve these resins in the wire mesh silver paste. In addition, additives such as dispersants, lubricants, coupling agents, etc. can be added as needed.Conductive silver pasteThe required characteristics include conductivity (anti-static), adhesion, printability, and solvent resistance.