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This series is a universal typeSilver palladium alloy conductor pasteSilver palladium paste is widely used in thick film circuits, sensors, and other fields that require high resistance to oxidation, corrosion, and soldering.
Typical characteristics: Different models can be selected according to sintering temperatures of 900 ℃, 950 ℃, 1000 ℃, 1050 ℃, 1100 ℃, and 1150 ℃
The sintered film is dense, and the silver palladium slurry has excellent conductivity, reliable adhesion, strong corrosion resistance, and oxidation resistance.
The silver palladium slurry meets the latest requirements and is free of harmful organic compounds.
XJY-Ag-5310 is a lead-free, cadmium free medium temperature silver paste suitable for thick film hybrid integrated circuits, leads and electrodes for separated components, internal wiring and terminal leads for medium temperature firing circuits, electrodes for semiconductor ceramic devices, etc..
TECHNICAL INDEX
product number |
Solid content (%) |
Fineness (μ m) |
Viscosity (Pa · s) |
XJY-Ag-5310 |
79-83 |
< 12.5 |
550-700 |
Recommended Process for Use
product number |
Drying temperature (℃) |
Drying time (min) |
Burning conditions |
||
Peak temperature (℃) |
Cycle (min) |
Insulation time (min) |
|||
XJY-Ag-5310 |
120-150 |
10-15 |
500-600 |
30 |
8-10 |
performance index
product number |
Burn film thickness (μ m) |
sheet resistivity (mΩ/□) |
Adhesion (vertical) N/2×2mm2 |
solderability |
XJY-Ag-5310 |
7-15 |
<5 |
>15 |
You (soldering iron) |
Silver platinum paste silver conductive paste Silver palladium conductor paste
precautions
Before use, please stir the slurry evenly for 10-20 minutes.
This slurry is a ready to use product and does not need to be diluted. If dilution is required, the amount added cannot exceed 3% (weight ratio). Excessive dilution will directly affect the performance of the slurry.
Storage conditions: 5-25 ℃, usage period: 6 months.
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