The smart phone FPC soft board is made of special insulation materials and conductor materials, such as polyimide (PI), which have excellent flexibility, high temperature resistance, and electrical performance. It can achieve various forms such as bending and folding while maintaining circuit functionality, making it very suitable for the complex and compact layout requirements inside smartphones.
core features
- Highly flexible:
- FPC flexible board can bend and fold freely, adapting to various irregular spaces and shapes inside smartphones.
- Lightweight design:
- The thickness is usually around 0.1mm, which helps to reduce the weight of smartphones and improve portability.
- High density wiring:
- Capable of arranging high-density circuits to meet the high integration requirements within smartphones.
- High temperature resistance:
- Made of high temperature resistant materials that can withstand high temperature welding and other processes, ensuring stability and reliability during the production process.
- Excellent electrical performance:
- Having a short wire structure and lower resistance helps to improve signal transmission speed and reduce signal loss.
application area
- Battery connection:
- Connect the battery to the motherboard to achieve stable transmission of battery power to various components of the phone.
- Internal component connections:
- Connect internal electronic components such as cameras, fingerprint recognition modules, and display screens to achieve signal transmission and interaction.
- Sensor connection:
- Connect various sensors, such as acceleration sensors, gyroscopes, etc., to ensure the normal operation of various functions of the smartphone.
Product advantages
- Improve design freedom:
- FPC soft boards can be designed in different shapes according to requirements and flexibly installed inside smartphones, making full use of space.
- Reduce the number of connectors:
- Simplifying the connector requirements of traditional cables helps improve the reliability of connections and the stability of signal transmission.
- Reduce installation costs:
- The flexible nature reduces installation difficulty, accelerates assembly speed, and reduces labor and material costs.
- Enhance durability:
- Having certain tensile and bending resistance is beneficial for improving the durability of smartphones.
Product customization
- Size customization:
- Customize according to the size and shape of the internal space of the smartphone.
- Route design:
- Design the circuit according to the functional requirements of the smartphone to ensure stable signal transmission.
- Material selection:
- Select appropriate materials based on the usage environment and performance requirements, such as high temperature resistance, corrosion resistance, etc.
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