Technical exploration on improving the anti migration performance of low-temperature conductive silver paste to prevent circuit short circuits

In the electronics industry, low-temperature conductive silver paste is widely used in fields such as printed electronics, flexible electronics, and photovoltaics due to its ability to achieve reliable electrical connections at lower temperatures. However, when these materials are exposed to humid or high humidity environments, ion migration may occur, which not only affects the stability of the conductive layer but may also lead to short circuits between circuits. This article will focus on the services provided by Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB8601 Low Temperature Conductive Silver PasteDiscuss how to enhance its anti migration performance by optimizing the formula and process.

1. Conductive silver paste and ion migration phenomenon

1.1 Overview of Conductive Silver Paste

Conductive silver paste is a composite material composed of micrometer or nanometer level silver powder, organic carrier, and other additives. It can solidify and form conductive paths at relatively low sintering temperatures, making it suitable for circuit manufacturing on heat sensitive substrates.

1.2 Ion migration mechanism

Ionic migration refers to the process of metal ions moving from one location to another under the action of an electric field. For silver paste, under the action of moisture, silver ions may dissolve and migrate towards the cathode driven by an electric field, ultimately leading to short-circuit faults between different potentials.

2. Characteristics of YB8601 low-temperature conductive silver paste

causeAdvanced Institute (Shenzhen) Technology Co., LtdThe YB8601 low-temperature conductive silver paste developed by R&D has the following characteristics:

• Low sintering temperature: The curing process can be completed below 150 ° C;

• High conductivity: ensures good current transmission efficiency;

• Excellent adhesion: ensuring good bonding with various substrate materials;

• Strong environmental adaptability: able to withstand temperature and humidity changes within a certain range.

3. Methods to improve anti migration performance

3.1 Improving the morphology of silver powder

Choosing the appropriate silver powder particle size distribution and shape can reduce contact resistance and lower surface energy, thereby suppressing the release of silver ions. For example, using spherical instead of flake silver powder can help reduce the gaps between particles and improve density.

3.2 Adding passivating agents or coatings

Adding a thin protective film or introducing specific chemical substances as passivators on the surface of silver powder can effectively prevent moisture from entering and silver ions from diffusing outward. For example, inorganic compound coatings such as silicon dioxide (SiO2) and aluminum oxide (Al2O3) have been proven to significantly improve migration resistance.

3.3 Optimizing the composition of organic carriers

Adjust the resin type and proportion in the organic carrier to make the cured polymer network more compact, while also possessing good flexibility and weather resistance. In addition, certain special functional monomers or copolymers can also provide additional protective effects to silver paste.

3.4 Control sintering conditions

By appropriately adjusting factors such as sintering time, temperature curve, and pressure, a more stable connection structure can be formed between silver powders, thereby enhancing the mechanical strength and chemical stability of the entire conductive layer.

4. Experimental verification and application cases

To verify the effectiveness of the above measures, the improved ones can be evaluated through accelerated aging tests (such as high temperature and high humidity tests), salt spray corrosion tests, and other methodsYB8601 low-temperature conductive silver pasteThe actual performance. According to existing research results, silver paste products that have undergone targeted treatment can still maintain stable electrical performance in harsh environments, greatly reducing the risk of short circuits caused by ion migration.

conclusion

By conducting in-depth analysis of the YB8601 low-temperature conductive silver paste from the Research Platinum brand and taking a series of effective improvement steps, we can significantly enhance the product's anti migration ability, providing more reliable security for electronic products. Future research will continue to explore more innovative solutions to meet the growing market demand and technological challenges.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.