New technology of copper alloy conductive adhesive: low-temperature curing achieves new breakthroughs in the electronics industry

With the rapid development of the electronics industry, the demand for high-performance conductive adhesives is increasing day by day. Although traditional conductive adhesives have certain conductivity properties, they have many limitations in curing temperature, conductivity stability, and cost. For this reason, a new type ofLow temperature cured copper alloy conductive adhesiveTechnology has emerged to solve the problems of traditional conductive adhesives while meeting the high efficiency and low cost requirements of modern electronic manufacturing. Advanced Institute Technology will explore the research and development background, preparation methods, performance characteristics, and application prospects of this new technology.

1、 Research and Development Background of Low Temperature Curing Copper Alloy Conductive Adhesive

In the assembly and packaging process of electronic components, conductive adhesive is widely used as a key material in fields such as circuit boards, sensors, and semiconductor devices. Traditional conductive adhesives usually use precious metals such as gold and silver as conductive fillers. However, these materials are not only expensive, but also prone to oxidation during high-temperature curing, which affects the stability of the conductive adhesive's performance. Regarding these issues,Low temperature cured copper alloy conductive adhesiveTechnology has emerged by using copper alloys as conductive fillers and combining them with special curing agents, allowing conductive adhesives to quickly cure at lower temperatures while maintaining excellent conductivity and stability.

2、 Preparation method of low-temperature cured copper alloy conductive adhesive

The preparation of low-temperature cured copper alloy conductive adhesive involves a fine process flow and precise material ratio. The following are the main steps for preparing this conductive adhesive:

2.1 Selection and Treatment of Conductive Fillers

Firstly, choose the appropriate oneCopper alloy powderAs a conductive filler. Copper alloy powder usually has good conductivity and oxidation resistance, making it suitable for use in low-temperature environments. In order to improve the adhesion between copper alloy powder and resin matrix, it is necessary to perform surface treatment on copper alloy powder, such as surface modification with silane coupling agent.

2.2 Preparation of Matrix Resin

Choose a low-temperature curing epoxy resin as the matrix material. In order to improve the mechanical properties and thermal stability of conductive adhesives, appropriate amounts of plasticizers, diluents, and curing accelerators can be added to the resin.

2.3 Mixing and curing of conductive adhesive

Mix the processed copper alloy powder evenly with the matrix resin in a certain proportion, and then add a curing agent. Curing reaction is carried out at room temperature or slightly higher temperature to form low-temperature cured copper alloy conductive adhesive with excellent conductivity.

3、 Performance characteristics of low-temperature cured copper alloy conductive adhesive

As a new type of material, the performance characteristics of low-temperature cured copper alloy conductive adhesive are mainly reflected in the following aspects:

3.1 Excellent conductivity performance

Due to the high conductivity of copper alloy powder, this conductive adhesive can form a continuous conductive path after curing, providing stable current transmission capability and suitable for high-density interconnection of electronic components.

3.2 Good stability and durability

Copper alloy powder is not easily oxidized under low-temperature curing conditions, ensuring the stability of the conductivity and mechanical properties of the conductive adhesive during long-term use.

3.3 Low temperature curing, easy to operate

The low-temperature curing characteristic allows conductive adhesive to quickly cure at lower temperatures, which not only reduces energy consumption but also shortens the production cycle and improves production efficiency.

3.4 Significant cost-effectiveness

Compared to traditionalGold and silver conductive adhesiveCompared with copper alloy conductive adhesive, the cost has been significantly reduced, providing higher economic benefits for electronic manufacturing enterprises.

4、 Application prospects of low-temperature cured copper alloy conductive adhesive

The application prospects of low-temperature cured copper alloy conductive adhesive are very broad, especially in the following fields where it has significant advantages:

4.1 Consumer Electronics Field

In consumer electronics products such as smartphones, tablets, and wearable devices, low-temperature cured copper alloy conductive adhesive can be used for circuit board mounting, chip connection, etc., meeting the needs of high-density integration and miniaturization.

4.2 Automotive Electronics

In the field of automotive electronics, low-temperature cured copper alloy conductive adhesive can be used for the assembly of automotive electronic control units and sensors, improving the reliability and performance of automotive electronic systems.

4.3 New Energy Technologies

In new energy technologies such as solar panels and wind power generation, low-temperature cured copper alloy conductive adhesive can be used for the connection and assembly of solar panels, improving the energy efficiency and lifespan of new energy equipment.

conclusion

Low temperature cured copper alloy conductive adhesiveThe emergence of technology has provided new solutions for the electronics industry, not only improving product performance but also driving innovation in electronic manufacturing processes. With the continuous improvement of this technology and the expansion of its application fields, low-temperature cured copper alloy conductive adhesive is expected to become an indispensable and important material in the future electronic industry.