The Influence of Hardness of Silver Palladium Paste on Circuit Reliability in Thick Film Hybrid Integrated Circuits

introduction

The importance of silver palladium paste in thick film hybrid integrated circuits

• Widely applicable fields: Silver palladium paste has good conductivity and chemical stability, and is widely used in various thick film hybrid integrated circuits, such as automotive electronics, aerospace, communication equipment, consumer electronics products, etc.
• Key Connection and Conductive Function: In circuits, silver palladium paste is used to connect different electronic components such as chips, resistors, capacitors, etc., ensuring stable current transmission and is one of the key materials for achieving circuit functions.

Characteristics of YB8503 thick film hybrid integrated circuit silver palladium paste from Yanbo brand

• Advanced formulas and processes:Advanced Institute (Shenzhen) Technology Co., LtdThe YB8503 silver palladium paste developed by R&D adopts advanced formulas and production processes, with high puritySilver palladium metal powderEnsure good conductivity.
• Excellent performance: The silver palladium paste has good printing adaptability, can form uniform and dense conductive films on different substrate materials, and has high adhesion and corrosion resistance, which can meet the requirements of complex circuits.

The Influence of Hardness on Circuit Reliability

• The impact on connection stability
  • Excessive hardness: If the hardness of the silver palladium paste is too high, it may cause problems such as cracking and detachment of the connection parts when the circuit is subjected to thermal stress, mechanical stress, etc., thereby affecting the electrical connection stability of the circuit. For example, in automotive electronic devices, due to vibrations and temperature changes during vehicle operation, silver palladium paste connection points with excessively high hardness may gradually loosen, leading to signal transmission interruption or increased resistance.
  • Low hardness: Conversely, silver palladium paste with low hardness may be easily worn or deformed during use, affecting the reliability of the connection. For example, in some electronic devices that are frequently plugged in and out, such as phone charger interfaces, silver palladium paste with low hardness may be scratched during the plugging process, causing damage to the conductive film and reducing the conductivity of the connection.
• The impact on heat dissipation performance
  • Excessive hardness: It can affect the thermal conductivity efficiency between the silver palladium paste and the substrate, causing heat to accumulate at the connection site and unable to dissipate in a timely manner, which may cause local overheating and affect the performance and lifespan of the circuit. For example, in the circuits near the CPU of high-performance computers, if the hardness of the silver palladium paste is too high and the heat dissipation is poor, it may cause the CPU to run at a lower frequency or even crash.
  • Low hardness: It may cause deformation of the silver palladium paste during the heat dissipation process, affecting its tight fit with the heat dissipation structure and reducing the heat dissipation effect. For example, in some power amplifier circuits, silver palladium paste with low hardness may deform under the pressure of the heat sink, resulting in poor contact between the heat sink and the circuit, affecting the heat dissipation performance.
• The impact on corrosion resistance performance
  • Excessive hardness: It may make the surface of silver palladium paste rough, increase the contact area with corrosive substances from the outside, and thus reduce its corrosion resistance. For example, in some harsh industrial environments such as chemical production workshops, silver palladium paste with excessively high hardness may be more quickly corroded by chemical substances, resulting in damage to the conductive film and affecting the reliability of the circuit.
  • If the hardness is too low, it may make the protective film of the silver palladium slurry not dense enough, making it easy for corrosive substances to penetrate, thereby affecting its corrosion resistance. For example, electronic devices used in marine environments may experience issues such as conductive film corrosion and short circuits due to the low hardness of silver palladium paste under salt spray erosion.

conclusion

In summary, Advanced Institute (Shenzhen) Technology Co., Ltd Research Platinum YB8503 Thick Film Hybrid Integrated Circuit Silver Palladium PasteThe hardness has a significant impact on the reliability of circuits. In practical applications, it is necessary to select a suitable hardness silver palladium paste according to the specific circuit usage environment and requirements to ensure the long-term stable operation of the circuit. At the same time, R&D personnel should continuously optimize the formula and production process of silver palladium paste to further improve its performance and reliability, in order to meet the growing demand for thick film hybrid integrated circuits in electronic technology.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.