UV cured conductive adhesive: technological innovation of high toughness, moisture resistant, and thermally conductive materials

In the rapidly developing electronics industry, conductive adhesive is a key material for connecting electronic components, and its performance directly affects the overall quality and reliability of the product. in recent years,UV curable conductive adhesiveDue to its unique curing method and superior performance characteristics, it has gradually become the focus of market attention. Advanced Institute Technology will provide a detailed introduction to a UV cured conductive adhesive that combines high toughness and moisture resistance, exploring its technical principles, preparation process, and application prospects.

Brief introduction

With the increasing trend of miniaturization and integration of electronic products, the performance requirements for conductive adhesives are also increasing. Traditional conductive adhesives often suffer from performance degradation and decreased conductivity when dealing with harsh environments such as high temperature and high humidity. Therefore, developing a product that can maintain stable performance in complex environments and has the ability to cure quicklyNew type of conductive adhesiveIt seems particularly important. UV cured conductive adhesives have emerged in this context, especially those products that combine high toughness and moisture resistance, which have become leaders in the industry.

2、 Technical characteristics of UV cured conductive adhesive

1. UV curing technology: UV curing is a process of rapidly transforming liquid materials into solid states through chemical reactions triggered by UV irradiation. Compared to traditional heat curing methods, UV curing has the advantages of fast curing speed, low energy consumption, and no need for heating, making it particularly suitable for temperature sensitive electronic component packaging.

2. High toughness: By optimizing the formula and preparation process of conductive adhesive, its toughness can be significantly improved.High toughness conductive adhesiveWhen subjected to external forces, it can better absorb and disperse energy, reduce the risk of fracture and damage, and improve the durability and reliability of the product.

3. Moisture and heat resistance: In response to the application requirements in high temperature and high humidity environments, UV cured conductive adhesive adopts a special moisture and heat resistance formula. This formula effectively improves the stability of conductive adhesive under high temperature and high humidity conditions by introducing high-temperature and moisture resistant additives and crosslinking agents, preventing the occurrence of conductivity degradation and aging phenomena.

4. Excellent conductivity: The addition of conductive fillers such as silver powder endows UV cured conductive adhesive with excellent conductivity. These fillers form a continuous conductive network in the conductive adhesive, ensuring effective connection and signal transmission between electronic components.

3、 Preparation process

The preparation process of UV cured conductive adhesive is complex and refined, mainly including the following steps:

1. Raw material selection and pretreatment: Select high-quality polymer matrixConductive silver powderRaw materials such as photoinitiators. Surface modification treatment of conductive silver powder to improve its compatibility and dispersibility with polymer matrix.

2. Mixing and dispersion: Mix the pre treated raw materials in a certain proportion and achieve uniform dispersion through processes such as high-speed stirring and ball milling. This step is crucial for forming a continuous and stable conductive network.

3. Coating and curing: Apply the uniformly mixed conductive adhesive onto the surface of the substrate, and then cure it by UV irradiation. During the curing process, it is necessary to strictly control parameters such as UV intensity, irradiation time, and curing temperature to ensure the curing effect and performance stability of the conductive adhesive.

4、 Application prospects

UV cured conductive adhesive, with its unique technical characteristics and superior performance advantages, has shown broad application prospects in multiple fields:

1. Electronic component packaging: In consumer electronics products such as smartphones, tablets, and wearable devices, UV cured conductive adhesive can be used for packaging chips, capacitors, resistors, and other components to improve product integration and reliability.

2. Circuit board manufacturing: In the manufacturing process of multi-layer circuit boards, flexible circuit boards, etc., UV cured conductive adhesive can be used to achieve interlayer interconnection and component soldering, improving the conductivity and mechanical strength of the circuit board.

3. Display screen and touch screen: In the manufacturing of OLED, LCD and other display screens and touch screens, UV cured conductive adhesive can be used for conductive connection and packaging of substrates such as ITO glass and PET film, improving display effect and touch sensitivity.

4. Photovoltaic industry: In the manufacturing of photovoltaic modules, UV cured conductive adhesive can be used for the connection and packaging of solar cells and substrates, improving the power generation efficiency and weather resistance of photovoltaic modules.

5. Other fields: In high-tech fields such as aerospace, automotive electronics, and medical equipment, UV cured conductive adhesives also have broad application potential and can meet complex and diverse application needs.

5、 Conclusion

High toughness, moisture resistant UV cured conductive adhesiveAs an innovative technological achievement in the field of electronic packaging, it not only solves the performance degradation problem of traditional conductive adhesives in extreme environments, but also improves production efficiency through rapid curing technology. Especially those products that combine high toughness and moisture resistance have become the new darlings of the market. With the continuous development of electronic technology and the expansion of application fields, the market demand for UV cured conductive adhesives will continue to grow, injecting new impetus into the development of the electronics industry. In the future, with the continuous advancement of materials science and preparation technology, the performance of UV cured conductive adhesives will be further improved, and their application fields will be more extensive.