Low temperature curing conductive silver paste: ushering in a new era of electronic packaging - Yanbo brand YB8614 leads the trend of innovation

With the rapid development of electronic technology, the integration level of electronic products is increasing, and the requirements for packaging materials are becoming increasingly strict. Traditional packaging processes often require high-temperature curing, which not only limits material selection but also increases production costs and energy consumption. To address this issue, Advanced Institute (Shenzhen) Technology Co., Ltd. has launched a research platinum brand YB8614Low temperature cured conductive silver paste for electronic packagingThis product has attracted widespread attention in the industry due to its outstanding performance and advanced technological features.

The revolutionary significance of low-temperature curing

Low temperature curing conductive silver pasteIt is a material that can be cured at relatively low temperatures, and its biggest advantage is that it can significantly reduce energy consumption, minimize thermal stress during production, and protect sensitive electronic components from damage. In addition, low-temperature curing technology can also expand the application range of materials, enabling the use of more types of substrates, such as plastics, flexible circuit boards, etc., which is of great significance for promoting the lightweighting and miniaturization of electronic products.

Technical highlights of YB8614 brand research platinum

Research Platinum YB8614 Low Temperature Curing Conductive Silver Paste for Electronic PackagingAdvanced Institute (Shenzhen) Technology Co., LtdAfter years of research and practice, a high-performance product has been successfully developed. The following are the main technical highlights and specific parameter data of this silver paste:

1. Excellent conductivity performance

   • Electrical resistivity: ≤ 30 μΩ·cm
   • Volume resistivity: ≤ 25 Ω·cm
   • Surface resistivity: ≤ 20 Ω/sq (100 μ m thick coating)

   YB8614 adoptsHigh purity silver powderAs a conductive phase, it ensures the conductivity of the material after curing. Its low resistivity makes it suitable for making precision circuits and high-performance electronic devices.

2. Rapid low-temperature curing

   • Curing temperature: 100 ° C to 150 ° C
   • Curing time: 30 minutes to 1 hour

   This product can cure quickly at lower temperatures (usually below 150 ° C), greatly shortening the production cycle and improving production efficiency. Meanwhile, low-temperature curing is also beneficial for protecting sensitive electronic components and avoiding damage caused by high temperatures.

3. Good adhesion

   • Tensile strength: ≥ 10 MPa
   • Shear strength: ≥ 8 MPa

   YB8614 has excellent adhesion and can form strong connections on various substrates, whether they are metal, ceramic, or plastic, ensuring long-term reliable electrical connections.

4. Stable chemical properties

   • Temperature resistance range:- 50 ° C to 200 ° C
   • Resistance to moisture and heat aging: Tested for 1000 hours at 85 ° C/85% RH

   The conductive silver paste formula has been specially designed to have excellent chemical stability and can maintain its performance unchanged in harsh environments for a long time, enhancing the reliability of electronic packaging.

5. Environmentally friendly

   • RoHS Compliance: Compliant with RoHS Directive requirements, does not contain harmful substances such as lead

   YB8614 is a green and environmentally friendly product that meets international environmental standards and is suitable for use in various environments with strict environmental requirements.

application area

YB8614 low-temperature cured conductive silver paste for electronic packaging is widely used in the following fields:

• Semiconductor packaging: suitable for chip bonding, wafer level packaging (WLP) and other processes to improve packaging quality and efficiency.
• Printed Circuit Board (PCB) Manufacturing: Used as a conductive adhesive in the PCB manufacturing process of multi-layer boards, flexible boards, etc., to simplify the process flow.
• Miniature electronic devices, such as wearable devices, smart watches, miniature sensors, etc., are ideal choices for low-temperature curing silver paste due to their lightweight characteristics.
• New energy industry: In fields such as solar panels and electric vehicle battery management systems, low-temperature curing technology can better meet the special needs of these industries.

look into the future

With the continuous development of electronic technology, the requirements for packaging materials will become increasingly high.YB8614 low-temperature cured conductive silver paste for electronic packagingWith its unique technological advantages, it has brought new solutions to the industry. In the future, with the advancement of materials science and optimization of production processes, we have reason to believe that low-temperature cured conductive silver paste will play an important role in more fields, promoting electronic packaging technology to new heights.

Advanced Institute (Shenzhen) Technology Co., Ltd. will continue to be committed to technological innovation, providing more high-quality products and services to the market, and assisting the sustained and healthy development of the electronic packaging industry. Through continuous exploration and practice, we look forward to the extraordinary charm of low-temperature cured conductive silver paste in more application scenarios, leading the new trend of electronic packaging technology.