Analysis of the influence of particle size of ultrafine copper powder on its application in conductive materials

With the development of microelectronics technology, ultrafine copper powder has become increasingly popular due to its excellent conductivityConductive copper paste, conductive copper adhesiveIt has been widely applied in various fields. Advanced Institute (Shenzhen) Technology Co., Ltd. will explore the impact of the particle size of ultrafine copper powder on its application in these conductive materials, and provide relevant data for explanation.

1、 Conductive copper paste

Conductive copper paste is a commonly used electronic material, widely used in fields such as printed circuit boards (PCBs) and solar panels.ultrafine copper powderIt is one of the main components of conductive copper paste, and its particle size directly affects the rheological properties, printability, and conductivity of the final product of the paste.

Granularity impact analysis:

• Particle size and rheological properties: According to the journal Materials Science and Engineering, when the average particle size of ultrafine copper powder is reduced from 1 μ m to 0.1 μ m, the viscosity of the slurry significantly decreases, which is beneficial for improving the printing suitability of the slurry. However, if the particles are too small, it may cause the slurry to be too thin, which is not conducive to forming a uniform thin film layer.

• Particle size and conductivity: Studies have shown that as the particle size of copper powder decreases, the number of particles per unit volume increases, thereby increasing the number of contact points between particles. This helps to form a more continuous conductive network, thereby enhancing the conductivity of the final product. For example, a study in the Journal of Metallurgy showed that when the particle size of copper powder was reduced from 5 μ m to 0.5 μ m, its conductivity increased by about 30%.

2、 Conductive copper adhesive

Conductive copper adhesive is mainly used for electronic packaging and connection, especially in situations where high conductivity is required, such as electromagnetic shielding, conductive pads, etc.

Granularity impact analysis:

• Particle size and adhesive strength: The selection of ultrafine copper powder particle size should take into account both conductivity and adhesive strength. Although particles that are too large can provide good conductivity, the difficulty in forming good contact between particles leads to a decrease in adhesive strength. According to the Journal of Electronic Packaging Technology, copper powder with a particle size of 1-3 μ m can achieve the best comprehensive performance.

• Particle size and curing behavior: A smaller copper powder particle size helps to shorten the curing time and reduce defects during the curing process. According to“Advanced Institute (Shenzhen) Technology Co., Ltd”A research report shows that conductive copper adhesive prepared with copper powder with a particle size less than 1 μ m has a curing speed about 40% faster than copper powder with a particle size greater than 5 μ m under the same conditions, and surface defects are significantly reduced.

3、 Brand Case - Research Platinum Brand Ultra fine Copper Powder

A high-performance ultrafine copper powder product launched by Advanced Institute (Shenzhen) Technology Co., Ltd. This product has won market recognition for its excellent particle size control technology and stable quality.

Particle size control technology: Advanced airflow grinding technology is adopted to ensure narrow particle size distribution of copper powder, with an average particle size of less than 0.5 μ m and a maximum particle size of no more than 3 μ m.

Application effect: In practical applications,Research Platinum Brand Ultra fine Copper PowderExcellent performance, especially in conductive copper paste, its conductivity is increased by more than 20% compared to products using ordinary copper powder, and it also has good printing adaptability and curing characteristics.

In summary, the particle size of ultrafine copper powder has a crucial impact on its application in conductive materials. Reasonable selection of copper powder particle size can not only improve the processing performance of materials, but also significantly enhance the conductivity and other physical properties of the final product.