Innovative Technology and Application Prospects of High Performance Conductive Silver Copper Adhesive

1、 Overview of Conductive Silver Copper Adhesive

Conductive silver copper adhesiveIt is a conductive adhesive made by scientifically proportioning and precisely mixing high-purity silver powder, copper powder, special resin matrix, curing agent, and various additives. It not only inherits the high conductivity of silver, but also integrates the economy and good mechanical properties of copper. Through optimized formula design, it achieves a perfect balance between conductivity and economy. Compared to traditional welding techniques, conductive silver copper adhesive has advantages such as no need for high-temperature treatment, easy operation, and can be applied to complex structures, greatly expanding its application range in the field of microelectronics.

2、 Breakthroughs in Preparation Process and Technology

2.1 Raw material preparation and pretreatment

• Silver copper powderSelect high-purity (usually above 99.9%) silver powder and copper powder asconductive fillerThe powder needs to undergo strict screening and grading to ensure uniform particle size distribution, usually controlled between a few micrometers to tens of micrometers to meet different application requirements. In addition, in order to improve the dispersibility of the powder in the resin matrix, it is sometimes necessary to perform surface treatment on the powder, such as adding dispersants or chemical modification.

• Resin matrix: Choose the appropriate resin type according to application requirements, such as epoxy resin, polyurethane, etc. Resin needs to be pre dried to remove moisture and volatile impurities, avoiding the formation of bubbles or affecting performance during the curing process.

• Additives and curing agents: Additives include dispersants, coupling agents, plasticizers, etc., used to improve powder dispersibility, enhance adhesive strength, etc; The curing agent is the key component that triggers resin cross-linking and curing. These components need to be accurately weighed in a certain proportion and thoroughly mixed with the resin matrix.
  

2.2 Mixing and dispersion

• Mechanical mixing: Using equipment such as ball mills and mixers, silver copper powder, resin matrix, additives, and curing agents are added to a mixing container according to the formula ratio for preliminary mechanical mixing. During the mixing process, it is necessary to control the stirring speed and mixing time to ensure sufficient contact and initial dispersion of each component.

• Ultrasonic dispersion: On the basis of mechanical mixing, ultrasonic dispersion technology is introduced. The high-frequency vibration of ultrasound can generate strong cavitation and micro jet effects, effectively breaking down powder aggregates and promoting uniform dispersion of powder in the resin matrix. The power, frequency, and time of ultrasonic dispersion need to be adjusted according to the specific formula and powder characteristics.

2.3 Vacuum defoaming

• Vacuum processing: mixing evenlyConductive silver copper adhesivePlace it in a vacuum defoamer and remove bubbles from the colloid by vacuuming. The vacuum degree needs to be controlled within a certain range (such as 0.08-0.09MPa), and the defoaming time is determined based on the viscosity of the colloid and the content of bubbles. Vacuum defoaming is an important step in improving the quality and conductivity of colloids.

2.4 Curing and Forming

• Curing process: Develop a suitable curing process based on the curing characteristics of the selected resin matrix. The curing process usually includes three stages: preheating, constant temperature curing, and post-treatment. The preheating stage is used to remove residual solvents and moisture from the colloid; During the constant temperature curing stage, the resin matrix undergoes cross-linking reactions, forming a stable network structure; The post-processing stage is used to further eliminate internal stress and improve colloidal properties.

• Curing equipment: The curing process requires the use of specialized curing equipment, such as ovens, UV curing machines, etc. Oven is used for thermal curing process, which requires precise control of heating temperature, heating rate, and holding time; UV curing machines are used for UV curing processes, ensuring that the intensity and irradiation time of the UV light source meet the curing requirements.

2.5 Post processing and Testing

• Post treatment: The cured conductive silver copper adhesive needs to undergo post-processing operations such as cutting and polishing to meet specific shape and size requirements. At the same time, cleaning, drying, and other treatments are required to remove surface residues and moisture.

• Performance testing: Conduct a series of performance tests on the prepared conductive silver copper adhesive, including conductivity (such as resistivity), adhesive strength, moisture and heat resistance, chemical corrosion resistance, etc. The test results must comply with relevant standards and customer requirements.

3、 Performance advantage analysis

• High conductivity: The efficient conductive network constructed by the silver copper bimetallic system ensures excellent conductivity and meets the low resistance connection requirements of high-precision electronic components.
• Good processability: It can quickly cure at room temperature or low temperature, suitable for precise coating and bonding of complex structural parts, and improves production efficiency.
• Environmental adaptability: Excellent resistance to moisture and chemical corrosion, ensuring long-term stable operation in harsh environments.
• Economically efficient: compared toPure silver conductive adhesiveSilver copper adhesive ensures conductivity while reducing costs and improving cost-effectiveness.

4、 Application prospects and prospects

1. Microelectronics packaging: With the continuous improvement of chip integration, the requirements for packaging materials are also increasing. Conductive silver copper adhesive has become an important material in advanced packaging technologies such as 3D packaging and TSV due to its excellent conductivity and processability.

2. Flexible electronics and wearable devices: achieving efficient conductive connections on flexible substrates is the key to the development of flexible electronics.Conductive silver copper adhesiveThe flexible and bendable characteristics provide strong support for the manufacturing of components such as flexible sensors and display screens.

3. High power electronic devices: In fields such as power electronics and new energy vehicles, high-power devices have strict requirements for the heat dissipation and conductivity of conductive materials. Conductive silver copper adhesive, with its excellent comprehensive performance, has become an ideal choice for connecting high-power modules.

4. Biomedical Engineering: In the biomedical field of neural interfaces, implantable electronic devices, etc., the biocompatibility and stability of conductive silver copper adhesive provide the possibility for its safe application in the human body.

conclusion

Conductive silver copper adhesive, as an innovative achievement in the field of electronic materials, is profoundly changing the design and manufacturing methods of electronic products with the continuous progress of its technology and the continuous expansion of its application areas. In the future, with the continuous development of materials science, nanotechnology, and intelligent manufacturing technology, the performance of conductive silver copper adhesive will be further improved, and the application boundaries will continue to expand, contributing to the construction of a more intelligent, efficient, and green electronic world.