How to control temperature and pressure during the sintering process of pressure sintered silver paste to avoid insufficient strength of the connecting layer

With the increasing application of third-generation semiconductor materials such as SiC (silicon carbide) and GaN (gallium nitride), the requirements for packaging interconnect materials have become more stringent. Traditional soldering materials are gradually being replaced by nano silver sintering technology that can withstand higher working temperatures and has good reliability due to their lower operating temperature limitations and poor thermal cycling stability. Among them, pressure sintered silver paste has become one of the research focuses in the industry due to its advantages of low-temperature connection and high-temperature service. This article will explore how to control temperature and pressure during the sintering process to avoid the problem of insufficient strength of the connecting layer, and will be developed by Advanced Institute (Shenzhen) Technology Co., LtdYanbo brand YB1011 pressure sintered silver pasteProvide an example for illustration.

1、 The importance of sintering temperature and pressure

The control of sintering temperature and pressure is a key technology in the application of pressure sintered silver paste. If the sintering temperature or pressure is insufficient, the silver paste may not be fully sintered, resulting in insufficient strength of the connecting layer and a decrease in conductivity. On the contrary, if the sintering temperature is too high or the pressure is too high, it may damage the chip and even destroy the entire circuit structure. Therefore, precise control of sintering temperature and pressure is crucial.

2、 Characteristics of YB1011 pressure sintered silver paste from Yanbo brand

Yanbo brand YB1011 pressure sintered silver paste is made ofAdvanced Institute (Shenzhen) Technology Co., LtdA high-performance interconnect material developed specifically to meet the packaging requirements of high-power modules. This product adopts a unique formula and technical route to ensure high-quality large-area bonding at lower temperatures. By applying appropriate pressure, the contact tightness between silver particles can be further improved, resulting in a denser and smoother connecting layer structure. In addition, YB1011 has good wetting properties and low electrical resistivity, making it suitable for various substrate materials.

3、 Control strategy for temperature and pressure

1. temperature control

   Sintering temperature is one of the key factors affecting the sintering quality of silver paste. Excessive temperature may lead to chip damage, while low temperature cannot achieve sufficient metallurgical bonding. Therefore, it is necessary to set the appropriate sintering temperature based on the specific composition of the silver paste and recommended process parameters. For example,YB1011 pressure sintered silver pasteThe sintering temperature is usually within a certain range, and the specific value needs to be determined based on experiments. In practical operation, precise temperature control equipment is required to ensure the stability and accuracy of sintering temperature.

2. pressure control

   The function of pressure is to promote close contact and fusion between silver particles, thereby improving the strength and conductivity of the connecting layer. However, excessive pressure may also cause damage to the chip or holes and cracks inside the connection layer. Therefore, when setting the sintering pressure, it is necessary to comprehensively consider the characteristics of the silver paste, the material of the substrate, and the size of the chip. YB1011 pressure sintered silver paste requires appropriate pressure to be applied during the sintering process, usually achieved through a precise pressure control system.

4、 Suggestions for optimizing process parameters

1. Choose the appropriate silver particle ratio

   The particle size and shape of silver particles have a significant impact on the mechanical properties of the sintered joint. Single sizenano silverStress concentration and crack formation may occur due to poor plasticity. Therefore, when preparing solder paste, an appropriate silver particle ratio should be selected, such as mixing nanoscale and micrometer sized silver particles to improve the plasticity of the sintered layer.

2. Fine tuning of process conditions

   Determine the optimal combination of sintering temperature, time, and pressure through experiments. During the sintering process, it is necessary to closely monitor the temperature curve and pressure changes to ensure the stability and consistency of the process parameters. Meanwhile, it is also necessary to consider the influence of factors such as substrate surface roughness on the quality of the joint.

3. Strengthen surface pretreatment

   Ensure that all surfaces involved in the connection are clean and free of contamination, and adjust surface characteristics appropriately to facilitate good adhesion. This can be achieved through methods such as cleaning, polishing, and chemical plating.

5、 Conclusion

Pressure sintered silver pasteIt has broad application prospects in the field of packaging and interconnection, but the temperature and pressure control during the sintering process have a significant impact on the strength of the connection layer. By precisely controlling the sintering temperature and pressure, selecting the appropriate silver particle ratio, finely adjusting the process conditions, and strengthening surface pretreatment, the problem of insufficient bonding layer strength can be effectively avoided. The YB1011 pressure sintered silver paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. has demonstrated excellent performance in this field, providing a new option for the development of packaging interconnect materials.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.