Exploring the pinnacle of technology: an innovative journey of advanced high-temperature co firing AlN multilayer wiring substrate hole filling tungsten paste

In the wave of technological progress, high-temperature co fired AlN multilayer wiring substrates have become an indispensable key material in modern electronics industry due to their excellent high temperature resistance, thermal conductivity, and electrical stability. However, how to efficiently and accurately fill the tiny holes in the substrate has always been a challenge that restricts its performance improvement.Advanced Institute of TechnologyWith its profound scientific research strength and unremitting exploration spirit, a high-temperature co fired AlN multi-layer wiring substrate filled with tungsten paste has been successfully developed, providing a new approach to solving this problem.

1、 Research and development background and significance of filling tungsten paste

With the rapid development of the electronics industry, the performance requirements for multi-layer wiring substrates are also increasing. Especially in extreme environments such as high temperature and high power, the stability and reliability of the substrate are particularly important. AlN, as an ideal substrate material, has been widely recognized for its excellent properties. However, filling holes in AlN multilayer wiring substrates has always been a technical challenge during the preparation process. Traditional filling materials often fail to meet performance requirements such as high temperature and high thermal conductivity, resulting in a decrease in the overall performance of the substrate. Therefore, developing a high-performance filling material is of great significance for improving the overall performance of AlN multilayer wiring substrates.

2、 Innovative characteristics of advanced institute filling tungsten slurry

This product developed by the Advanced InstituteFill hole tungsten pasteWith its unique formula and preparation process, it exhibits outstanding performance characteristics. The filling tungsten paste uses high-quality tungsten powder mixture as the main material, and achieves precise filling of substrate holes by finely controlling the particle size and distribution of tungsten powder. At the same time, an appropriate amount of inorganic binder and organic carrier were added to the filling tungsten paste, effectively improving the adhesion and flowability of the filling material, further ensuring the filling effect.

In practical applications, advanced institute's filling tungsten paste has shown excellent high temperature resistance and high thermal conductivity. Even in extreme environments, it can maintain stable performance, effectively improving the overall performance and reliability of AlN multilayer wiring substrates. In addition, the filled tungsten paste also has excellent processing and environmental performance, which meets the demand of modern electronic industry for high-performance and environmentally friendly materials.

3、 Exploration and optimization of the preparation process of pore filling tungsten paste

Advanced Institute has conducted in-depth exploration and optimization in the preparation process of pore filling tungsten paste. By adjusting the raw material ratio and optimizing the preparation process, efficient preparation of pore filling tungsten slurry has been successfully achieved. At the same time, the Advanced Institute also emphasizes cooperation and communication with the industry, constantly transforming the latest scientific research achievements into practical application products, and promoting the development of the electronics industry.

4、 Future prospects and challenges

With the continuous development of the electronics industry, the demand for high-performance multi-layer wiring substrates will become increasingly high. The Advanced Institute will continue to increase research investment and continuously optimize the preparation process and performance of hole filling tungsten paste to meet the market's demand for high-performance and high reliability multilayer wiring substrates. At the same time, the Advanced Institute will actively explore new application areas and market opportunities, contributing more to the development of the electronics industry.

conclusion

High temperature co fired AlN multilayer wiring substrate developed by Advanced InstituteFill hole tungsten pasteWith its outstanding performance and unique preparation process, it has injected new vitality into the development of the electronics industry. In the future, we have reason to believe that with the continuous efforts of advanced research institutions such as advanced institutes, the electronics industry will usher in a better tomorrow.