Application effect of PI thin film nickel plating in heat sink components as a thermal conductive material

Brief introduction

With the continuous development of modern electronic devices, heat dissipation has become one of the key factors restricting the improvement of device performance and the extension of lifespan. Among numerous thermal conductive materials,Nickel plating on PI filmDue to its unique performance, it has gradually gained attention. The PI film itself has various excellent characteristics, and the introduction of nickel plating further improves its thermal conductivity, making it potentially applicable in heat sink components.

2、 Thermal conductivity principle of PI thin film nickel plating

Nickel plating on PI film is the process of depositing a layer of nickel on the surface of polyimide (PI) film through chemical plating or electroplating. Nickel is a metal with good thermal conductivity, and its thermal conductivity mechanism is mainly based on electronic thermal conduction. After nickel plating on the surface of PI film, heat can be rapidly conducted through free electrons in the nickel layer, and PI film can also assist in heat transfer to a certain extent. This composite structure enables efficient heat transfer from the heat source to other parts of the heat dissipation device, thereby achieving the purpose of heat dissipation.

3、 Application effect of PI thin film nickel plating in radiator components

（1） Heat dissipation efficiency

1. thermal conductivity
   • The thermal conductivity of nickel is relatively high, about 90.9 W/(m · K). When the nickel plating layer uniformly covers the surface of the PI film, it can significantly improve the overall thermal conductivity of the material. according toAdvanced Institute (Shenzhen) Technology Co., LtdAccording to research data, the thermal conductivity of PI films after nickel plating is significantly improved compared to those without nickel plating. For example, the thermal conductivity of untreated PI film may be between 0.1-0.3 W/(m · K), while the thermal conductivity of PI film nickel plated material treated with appropriate nickel plating process can be increased to 1-5 W/(m · K), which enables heat to be conducted more quickly from the heat source and effectively improves the heat dissipation efficiency of the heat dissipation device.
2. Reduced thermal resistance
   • In radiator components, thermal resistance is an important indicator for measuring heat dissipation performance. Nickel plating on PI film can reduce the thermal resistance in the heat dissipation path. Thermal resistance is inversely proportional to thermal conductivity, and as the thermal conductivity increases after nickel plating, the thermal resistance decreases accordingly. Experimental data shows that in the same heat dissipation structure, using PI thin film nickel plating material can reduce thermal resistance by 30% -50% compared to not using it. This means that under the same heat source power, using PI thin film nickel plated heat dissipation devices can more efficiently dissipate heat, thereby reducing the temperature of the heating element.

（2） Thermal stability

1. Performance retention at high temperatures
   • PI film itself has good thermal stability and can maintain its physical and chemical properties at higher temperatures. The nickel layer also has a certain degree of high-temperature stability. The test results of Advanced Institute (Shenzhen) Technology Co., Ltd. show that,Nickel plating on PI filmAt high temperatures of 200-300 ° C, the attenuation of its thermal conductivity is relatively small. For example, after working continuously at a high temperature of 250 ° C for 100 hours, its thermal conductivity only decreases by about 10% -15%, indicating that PI thin film nickel plating can maintain relatively stable heat dissipation performance in high-temperature heat dissipation applications, ensuring the reliability of heat sink components in high-temperature environments.
2. Match the thermal expansion coefficient with other materials
   • In radiator components, there are often combinations of multiple materials involved. The thermal expansion coefficient of PI thin film nickel plating has good compatibility with some commonly used heat dissipation materials, such as metal heat sinks. The thermal expansion coefficient of PI film is relatively low, and the thermal expansion coefficient of nickel layer is also suitable for other materials within a certain range. This matching can reduce the stress caused by thermal expansion differences during temperature changes, avoid structural damage such as delamination and cracking of heat sink components due to thermal stress, and thus improve the overall stability and service life of heat sink components.

（3） Chemical stability and reliability

1. corrosion resistance
   • The nickel layer has certain corrosion resistance and can protect the PI film from certain chemical substances. In some heat dissipation environments where there may be a risk of chemical corrosion, such as air environments containing small amounts of acidic and alkaline components or heat dissipation devices in specific chemical industrial environments, PI thin film nickel plating can maintain the stability of its performance. The research conducted by Advanced Institute (Shenzhen) Technology Co., Ltd. shows that the thermal conductivity and structural integrity of PI thin film nickel plating are basically not affected for a long time (such as more than 1000 hours) in an environment with a pH value of 4-9, which provides a reliable guarantee for its application as a heat sink component in complex environments.
2. Long term reliability
   • During the long-term operation of heat dissipation devices, PI thin film nickel plating exhibits good reliability. Due to its excellent thermal conductivity, thermal stability, and chemical stability, there will be no significant performance degradation after prolonged use. For example, in accelerated aging tests simulating actual usage environments, after testing equivalent to 5-10 years of use, PI film nickel plated heat sink components can still maintain over 80% of their initial heat dissipation efficiency, indicating thatNickel plating on PI filmThe application in radiator components has high long-term reliability.

4、 Conclusion

In summary, nickel plating on PI thin film is recommended asThermal conductive materialHas good application effect in radiator components. In terms of heat dissipation efficiency, it can effectively conduct heat away from the heat source by increasing the thermal conductivity and reducing the thermal resistance; In terms of thermal stability, it performs well in maintaining performance at high temperatures and matching the thermal expansion coefficient with other materials; In terms of chemical stability and reliability, it can also meet the long-term usage requirements of heat sink components in different environments. The research results of Advanced Institute (Shenzhen) Technology Co., Ltd. in this field further demonstrate the potential application of PI thin film nickel plating in heat sink components. With the continuous development of heat dissipation technology, PI thin film nickel plating is expected to be widely used in more heat dissipation components, providing an effective solution to the heat dissipation problems of modern electronic devices.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.