The influence of microstructure and phase composition of low-temperature conductive silver paste on its conductivity properties

With the development of the electronics industry, especially the increasing demand for flexible electronic products, wearable devices, and large-area printed circuit boards, low-temperature curing conductive silver paste has received widespread attention as a key material.Research Platinum YB8601 Low Temperature Conductive Silver PasteDeveloped by Advanced Institute (Shenzhen) Technology Co., Ltd., it can achieve good conductivity at lower temperatures and maintain excellent mechanical properties. This article will explore how the microstructure and phase composition of this silver paste affect its conductivity.

The Importance of Microstructure

Silver particle morphology and distribution

The size, shape, and distribution of silver particles in low-temperature conductive silver paste within the matrix are important factors determining its conductivity. Smaller and uniformly dispersed silver particles can provide more contact points, thereby reducing resistance; Larger or irregularly shaped particles may cause local current concentration, generate hot spot effects, and affect overall conductivity efficiency. In addition, good connections between particles are also key to ensuring a low resistance path.

Particle size and distribution

The particle size directly affects the filling density and interface state. Silver powder with smaller particle size can usually better fill the gaps and form a continuous conductive network, but too small particle size may cause particle agglomeration during sintering, which is not conducive to conductivity. Therefore, selecting the appropriate average particle size and reasonable particle size distribution is crucial for optimizing the conductivity performance.

Characters composed of phases

conductive phase

Silver, as the main conductive phaseLow temperature conductive silver pasteIt provides necessary electronic transmission channels. Silver itself has extremely high electrical conductivity, which enables it to maintain good conductivity even under low temperature conditions. In order to improve the conductivity, the physical properties of silver paste can be adjusted by adding other metal or alloy components, such as improving adhesion, heat resistance, and oxidation resistance.

Guading Xiang

In addition to silver particles, low-temperature conductive silver paste also contains a certain proportion of organic binders or other inorganic substances as binding phases. These non-conductive components serve to fix the silver particles and prevent them from migrating or settling before solidification. However, excessive binding will hinder direct contact between silver particles, thereby increasing resistance. Therefore, finding a balance point to ensure sufficient bonding strength without affecting conductivity is crucial.

impurity phase

Any impurities present in silver paste can have a negative impact on conductivity. For example, oxides, sulfides, or other non-metallic inclusions may lead to the formation of localized high resistance areas, weakening the conductivity of the entire system. Therefore, strict control of raw material purity and preparation process during the production process, reducing impurity content, is crucial for obtaining high-quality products.

conclusion

Through in-depth researchResearch Platinum YB8601 Low Temperature Conductive Silver PasteBy analyzing the microstructure and phase composition, we can more accurately understand and predict its conductive behavior. Advanced Institute (Shenzhen) Technology Co., Ltd. is committed to developing high-performance low-temperature conductive silver paste, continuously improving formulas and technologies, aiming to provide customers with more reliable and efficient electronic material solutions. Future research will continue to focus on how to further optimize microstructure design and phase composition regulation to meet the special needs of different application scenarios.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.