Study on the Influence of Colloidal Particle Concentration on the Properties of Conductive Silver Copper Adhesive

overview

Conductive silver copper adhesiveDue to its excellent conductivity and good adhesive properties, it has been widely used in fields such as electronic packaging and microelectronic assembly. However, the concentration of colloidal particles has a significant impact on the conductivity and bonding strength of such adhesives. This article explores the specific effects of high or low colloidal particle concentration on the performance of conductive silver copper adhesive through experimental data, and proposes optimization suggestions.

Experimental Materials and Methods

The conductive silver copper adhesive used in this experiment isResearch Platinum Brand YB6020Provided by Advanced Institute (Shenzhen) Technology Co., Ltd. The experiment aims to explore the effects of different concentrations of colloidal particles on the conductivity and bonding strength of adhesives. The experimental materials include copper foil, stainless steel sheets, etc. All materials undergo strict surface treatment before the experiment to remove oil stains and other impurities.

Experimental Design and Implementation

To investigate the effect of colloidal particle concentration onConductive silver copper adhesiveWe have prepared four different concentrations of adhesive samples, labeled as A, to assess their impact on performance B、C、D。 Among them:

• The colloidal particle concentration of sample A is 10wt%;
• The colloidal particle concentration of sample B is 20wt%;
• The colloidal particle concentration of sample C is 30wt%;
• The colloidal particle concentration of sample D is 40wt%.

Each sample was cured under the same conditions and tested for conductivity and adhesive strength after curing.

Experimental results and analysis

Conductivity testing

Through conducting conductivity tests on samples of four different concentrations, we found that as the concentration of colloidal particles increases, the conductivity shows a trend of first increasing and then decreasing. The specific data is as follows:

• Sample A (10wt%): resistivity of 2 Ω/□;
• Sample B (20wt%): The resistivity decreased to 1 Ω/□;
• Sample C (30wt%): The resistivity further decreases to 0.5 Ω/□;
• Sample D (40wt%): The resistivity has rebounded to 1.5 Ω/□.

From the data, it can be seen that the conductivity is optimal when the concentration of colloidal particles is between 20wt% and 30wt%. When the concentration continues to increase to 40wt%, the conductivity actually decreases, which may be due to the formation of non-conductive paths between colloidal particles caused by excessive concentration, thereby reducing the overall conductivity.

Adhesive strength test

We have also observed a similar trend in adhesive strength testing. The adhesive strength of sample A is the lowest, at 2MPa; The adhesive strength of sample B has been increased to 3.5 MPa; Sample C reached a peak of 4MPa; And the adhesive strength of sample D decreased again to 3MPa.

It can be seen that when the concentration of colloidal particles is moderate (20wt%~30wt%),Conductive silver copper adhesiveThe adhesive strength is the highest. Both low and high concentrations can lead to a decrease in adhesive strength. Too low a concentration cannot provide sufficient particle contact area to form an effective conductive network, while too high a concentration may lead to particle accumulation, forming non-conductive areas and affecting adhesive performance.

Comparative analysis of data

From the above experimental data, it can be seen that the concentration of colloidal particles has a significant impact on the conductivity and bonding strength of conductive silver copper adhesive. Sample C (30wt%) has the best comprehensive performance, ensuring good conductivity and providing sufficient adhesive strength. In contrast, sample A (10wt%) and sample D (40wt%) performed poorly. The former had lower conductivity and adhesive strength, while the latter had improved conductivity at high concentrations but decreased adhesive strength.

conclusion

From the above experimental data, it can be seen that the concentration of colloidal particles has a significant impact on the conductivity and bonding strength of conductive silver copper adhesive. In practical applications, selecting the appropriate concentration of colloidal particles is crucial. It is recommended to use conductive silver copper adhesive with a concentration between 20wt% and 30wt% to achieve optimal conductivity and adhesive strength.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.