Low temperature curing silver copper conductive adhesive helps the electronics industry innovate efficiently

The electronics industry is developing at an unprecedented speed, and the performance requirements for materials are also increasing day by day.Conductive adhesiveAs an indispensable material in electronic component manufacturing, its performance directly affects the quality and performance of electronic products. However, traditional conductive adhesives have many problems during high-temperature curing, such as easy oxidation, high cost, and low production efficiency. In order to overcome these challenges, low-temperature curing silver coated copper conductive adhesive has emerged, which brings new opportunities to the electronics industry with its unique advantages.

1、 Characteristics of Low Temperature Curing Silver Copper Conductive Adhesive

Low temperature curing silver coated copper conductive adhesive is a type of conductive filler that uses micrometer sized silver coated copper powder as the conductive fillerNew conductive materialsIt not only solves the problem of traditional copper powder being prone to oxidation, but also reduces costs, improves conductivity and production efficiency.

1.1 Excellent antioxidant performance

Traditional copper powder conductive adhesive is prone to oxidation during high-temperature curing, leading to a decrease in conductivity. The silver layer in the silver coated copper conductive adhesive can effectively isolate the contact between copper powder and air, greatly reducing the risk of oxidation and improving the stability and service life of the conductive adhesive.

1.2 Significant cost-effectiveness

The silver coated copper powder in the silver coated copper conductive adhesive has a lower cost than pure silver powder, while maintaining excellent conductivity. In addition, by optimizing the preparation process, the production cost of conductive adhesive can be further reduced, and its cost-effectiveness can be improved, thereby meeting the demand of the electronics industry for high-performance and low-cost materials.

1.3 Rapid low-temperature curing

Traditional conductive adhesives typically require long-term curing at high temperatures, which not only increases energy consumption but also limits production efficiency. (取决于上下文，如"but"Low temperature curing silver copper conductive adhesiveThe combination of amine and anhydride curing agents produces a good synergistic effect, enabling rapid low-temperature curing and greatly improving the operability and production efficiency of conductive adhesives.

2、 Preparation Method of Low Temperature Curing Silver Copper Conductive Adhesive

The preparation method of low-temperature cured silver coated copper conductive adhesive mainly includes the following steps:

2.1 Raw material selection and proportioning

Firstly, it is necessary to select suitable raw materials such as epoxy resin, curing agent, diluent, and plasticizer. Among them, the epoxy value of epoxy resin is usually 40-60 equivalents/100g; The curing agent can be one or a combination of amine curing agents and anhydride curing agents; Diluents usually use anhydrous ethanol; Plasticizers can be chosen from substances such as phthalic acid. Reasonably proportion each raw material according to actual needs.

2.2 Preparation of Conductive Fillers

Mixing copper powder with silver salt solution, forming a layer of silver on the surface of copper powder through chemical reaction, to produce micrometer sized silver coated copper powder. The key to this step is to control the thickness and uniformity of the silver layer to ensure the conductivity of the conductive adhesive.

2.3 Preparation of Conductive Adhesive

Mix epoxy resin, curing agent, diluent, and plasticizer in a certain proportion, and then add the prepared silver coated copper powder. Stir thoroughly to evenly disperse the silver coated copper powder in the resin matrix. Finally, by adjusting the viscosity and rheological properties, the requiredLow temperature curing silver copper conductive adhesive.

3、 Application prospects of low-temperature cured silver coated copper conductive adhesive

Low temperature cured silver coated copper conductive adhesive has a wide range of application prospects in the electronics industry due to its excellent performance and preparation method advantages.

3.1 Consumer Electronics Products

In consumer electronics products such as smartphones, tablets, and laptops, low-temperature cured silver coated copper conductive adhesive can be used for battery connection, screen bonding, circuit board soldering, and other processes to improve product performance and reliability.

3.2 Industrial Automation

In the field of industrial automation, low-temperature cured silver coated copper conductive adhesive can be used for the manufacturing of sensors, actuators, and other components, improving the stability and durability of equipment.

3.3 New Energy Vehicles

With the rapid development of the new energy vehicle market, low-temperature cured silver coated copper conductive adhesive has broad application space in key components such as battery management systems and motor control systems.

conclusion

In short,Low temperature curing silver copper conductive adhesiveAs a new type of high-performance conductive material, it has brought new development opportunities to the electronics industry with its advantages of oxidation resistance, low cost, and rapid low-temperature curing. With the continuous advancement of preparation technology and the expansion of application fields, it is believed that this conductive adhesive will play a more important role in the future electronics industry.