Innovative technology of low-temperature curing nano silver paste leads the new era of electronic packaging

With the rapid development of electronic technology, the demand for high-performance and high reliability electronic packaging materials is increasing day by day.Low temperature curing nano silver pasteAs an emerging thermal interface material, it is gradually becoming a shining star in the field of electronic packaging due to its unique low-temperature sintering characteristics and excellent thermal conductivity. Advanced Institute Technology deeply explores the preparation technology, performance advantages, and application prospects of low-temperature cured nano silver paste in the field of electronic packaging, in order to provide valuable references for researchers and engineers in related fields.

Preparation Technology of Low Temperature Curing Nano Silver Paste

The key to the preparation of low-temperature cured nano silver paste lies in the dispersion of nano silver particles and the reasonable ratio of organic components. Nano silver particles are prone to agglomeration during the preparation process due to their high specific surface area and surface energy, which affects the performance of the final product. Therefore, to solvenano-silverThe issue of reunion is the primary task in the preparation process. By optimizing the type, dosage, and ultrasonic treatment time of surfactants, uniform dispersion of silver nanoparticles can be effectively achieved.

Meanwhile, the selection of organic component systems is also crucial. The system needs to have chemical stability, be able to evaporate or decompose before the highest sintering temperature, and not affect the thermal conductivity of the sintered silver layer. In addition, it is necessary to ensure that the viscosity of the silver paste is moderate for easy coating and to form a defect free silver layer after sintering.

Performance advantages

1. Low temperature sintering characteristics

The biggest highlight of low-temperature cured nano silver paste is its extremely low sintering temperature. The traditional silver paste sintering temperature is often high, which limits its application in certain temperature sensitive materials. The low-temperature solidification of nano silver paste significantly reduces the external driving force required for sintering through the high surface energy characteristics of nanoparticles, resulting in a significant decrease in sintering temperature. For example, some products can be sintered at around 120 ℃, greatly expanding their application range.

2. High thermal conductivity

The silver layer formed after low-temperature solidification of nano silver paste sintering has extremely high thermal conductivity, with a thermal conductivity of up to 193.7 W/(K · m), far exceeding traditional methodsThermal interface materialThis feature demonstrates great potential in heat dissipation solutions for high-power electronic devices.

3. Excellent mechanical performance

The shear strength of the sintered joint is as high as 37.5MPa, ensuring the stability and reliability of the electronic packaging structure. At the same time, low-temperature cured nano silver paste also exhibits good sustained printability and weather resistance, meeting the requirements of complex electronic packaging processes.

application area

Low temperature curing nano silver pasteWith its unique performance advantages, it has shown broad application prospects in multiple fields:

• Folding screens and flexible screens: In the production of conductive lines and electrodes for folding screens and flexible screens, the low-temperature sintering characteristics and high flexibility of low-temperature cured nano silver paste have become ideal choices.
• OLED lighting and display: In OLED lighting and display devices, the excellent thermal conductivity of low-temperature cured nano silver paste helps to improve the heat dissipation efficiency of the device and extend its service life.
• MircoLED/MiniLED： In micro display technologies such as MircoLED and MiniLED, the high-precision printing ability and low resistivity characteristics of low-temperature cured nano silver paste provide a new solution for electrode fabrication.
• Smart Home and Wearable Devices: In the field of smart home and wearable devices, the flexibility and reliability of low-temperature cured nano silver paste make it the preferred material for connecting circuits and sensors.

Conclusion and Prospect

Low temperature curing nano silver paste, as an innovative technology in the field of electronic packaging, is gradually changing the pattern of traditional electronic packaging materials with its unique low-temperature sintering characteristics and excellent performance. In the future, with the continuous maturity of preparation technology and the expansion of application fields, low-temperature cured nano silver paste is expected to play an important role in more high-end electronic products, promoting the continuous progress of electronic technology.

This article systematically introduces the preparation technology, performance advantages, and application prospects of low-temperature cured nano silver paste in the field of electronic packaging. We firmly believe that with the unremitting efforts of researchers, low-temperature cured nano silver paste will usher in a more brilliant tomorrow and contribute more to the development of electronic technology.