Surface resistivity control of PI copper plated film: strategies to meet different requirements

PI copper plated filmAs a high-performance composite material, it has been widely used in the modern electronics industry due to its combination of the excellent physical properties of polyimide and the high conductivity of copper. This article aims to explore how to meet different needs by controlling the surface resistivity of PI copper plating film, and to cite relevant data and comparisons to demonstrate the advantages of Advanced Institute (Shenzhen) Technology Co., Ltd. in this field.

Basic characteristics of PI copper plated film

PI copper plated film is a composite material formed by coating copper on the surface of polyimide film. Polyimide film is known for its high heat resistance (glass transition temperature can reach around 350 ℃), corrosion resistance, good mechanical strength, and electrical insulation properties. When copper is combined with polyimide, this composite material not only inherits the above advantages of polyimide, but also possesses the high conductivity of copper. The surface resistivity of PI copper plated film is usually 1-10 Ω/sq, depending on the thickness of the copper plating layer and the preparation process.

Strategy for controlling surface resistivity

1. Adjust the thickness of the copper plating layer:
   The surface resistivity of PI copper plated film is closely related to the thickness of the copper plating layer. By adjusting the thickness of the copper plating layer, the surface resistivity can be controlled within a certain range. For example, increasing the thickness of the copper plating layer can reduce surface resistivity, but an excessively thick copper plating layer may lead to increased material costs and processing difficulties.

2. Optimize the preparation process:
   Advanced Institute (Shenzhen) Technology Co., LtdThrough advanced preparation processes and technologies such as vacuum magnetron sputtering, a high-purity oxygen free copper conductive layer is deposited on the surface of PI thin films to precisely control the surface resistivity. This technology not only improves the conductivity, but also maintains the original chemical and physical properties of polyimide films.

3. Choose appropriate measuring instruments and methods:
   Using a dedicated surface resistivity tester and measuring according to national standards can ensure the accuracy of the data. The four probe method is a commonly used and reliable measurement method that can eliminate the influence of contact resistance between the test electrode and the conductive coating, and improve measurement accuracy.

application prospect

Due to its excellent conductivity and heat resistance, PI copper plated film has broad application prospects in fields such as flexible circuit boards, automotive electronics, microelectronic packaging, new energy, and electrical insulation. Especially in high-tech fields such as 5G and the Internet of Things,Advanced Institute Technology PI Copper Plating FilmIt will play a crucial role.

• Flexible Electronics: The lightweight and durable characteristics of PI copper plated film enable smart wearable devices such as flexible displays and sensors to be closer to the human body, providing a more comfortable and convenient user experience.
• Microelectronics packaging: PI copper plated film has become an ideal choice in the field of microelectronics packaging due to its good thermal stability and electrical performance. It can effectively reduce the impact of thermal stress on chips, improve packaging density and reliability.
• New energy: In new energy equipment such as lithium batteries and solar cells, the high conductivity and good insulation performance of PI copper plated film help improve the energy conversion efficiency and safety of the battery.

conclusion

By adjusting the thickness of the copper plating layer, optimizing the preparation process, and selecting appropriate measuring instruments and methods, the surface resistivity of the PI copper plating film can be effectively controlled to meet the needs of different application scenarios. The Advanced Institute Technology PI copper plating film provided by Advanced Institute (Shenzhen) Technology Co., Ltd. has significant advantages in this field and is indispensable in the modern electronics industryNew conductive materialsThe high precision, stability, and adaptability of PI copper plated film make it one of the important directions for the future development of electronic materials.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.