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With the rapid development of modern electronic technology, multi-layer ceramic capacitors (MLCC) are increasingly widely used in electronic devices. In order to meet the increasing demand for performance, the manufacturing technology of ultra-high capacity MLCC (multi-layer ceramic capacitors) is also constantly advancing.nickel pasteAs an important material for manufacturing ultra-high capacity MLCC internal electrodes, its technical characteristics and application are worth further exploration.
Nickel paste is a specialized material used for manufacturing base metal internal electrodes (BME) MLCCconductive pasteIn the manufacturing process of MLCC, nickel paste is used to form internal electrode layers, which are alternately stacked with ceramic dielectric layers to form a complete capacitor structure through high-temperature co firing technology. The use of nickel slurry is mainly due to its cost-effectiveness and electrochemical stability at high temperatures, which makes nickel an ideal choice to replace expensive precious metals such as silver and palladium.
The typical characteristics of nickel slurry include:
1. Composition: Mainly composed of ultrafine nickel powder, organic carrier (including binder, solvent, dispersant, etc.), and additives (such as curing agent, rheological modifier). Nickel powder provides conductivity, while organic carriers ensure good printing performance and stability of the paste after sintering.
2. Printing performance: Nickel paste should have good printing adaptability and be able to be accurately printed on ceramic green sheets through screen printing and other processes, forming thin and uniform electrode layers.
3. Sintering characteristics: During the high-temperature sintering process, the organic components in the nickel slurry will be removed, leaving a pure nickel electrode while forming a tight bond with the ceramic dielectric, without affecting the electrical performance of the capacitor.
In order to meet the performance requirements of ultra-high capacity MLCC, the technical requirements for nickel paste are also increasing. This is mainly reflected in the following aspects:
1. High conductivity: The conductivity of nickel paste directly affects the internal resistance and capacity of MLCC. Therefore, it is necessary to select high-purity ultrafine nickel powder and improve the conductivity of the nickel slurry by optimizing the formula and process.
2. Good printing performance: In order to achieve a thin and uniform electrode layer, nickel paste needs to have good printing performance. This requires nickel paste to have appropriate viscosity and flowability in order to accurately control the thickness and uniformity of the electrode layer in processes such as screen printing.
3. Excellent sintering performance: During the high-temperature sintering process, the nickel slurry needs to form a tight bond with the ceramic medium while maintaining the integrity and conductivity of the electrode layer. Therefore, it is necessary to select nickel slurry with excellent sintering performance and optimize the sintering process to achieve good bonding between the electrode layer and the ceramic medium.
At present,Nickel paste for ultra-high capacity MLCCIt has been widely used in electronic products such as smartphones, tablets, and automotive electronics. With the rapid development of technologies such as 5G and the Internet of Things, these electronic products have increasingly high performance requirements for MLCC. Therefore, the market demand for nickel paste for ultra-high capacity MLCC is also constantly increasing.
In order to meet market demand, major slurry manufacturers are constantly developing new nickel slurry products to improve their performance and quality. At the same time, some companies with technological advantages and innovation capabilities have also begun to enter this field, injecting new vitality into the industry.
In short, nickel paste for ultra-high capacity MLCC is one of the key materials for manufacturing high-performance MLCC. With the continuous development of electronic technology, the performance requirements for nickel paste are also increasing. In the future, with the continuous emergence of new materials and processes, the performance and application of nickel paste for ultra-high capacity MLCC will be further improved.
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