High performance PI copper plated film: customized solution, leading future technological development

In the rapidly developing electronics industry, the performance of materials directly affects the quality and competitiveness of products. Polyimide (PI) films are widely used in various fields due to their excellent heat resistance, electrical insulation, and mechanical strength. With the advancement of technology, the application of PI thin film surface coated with metal layer, especially copper plated film, is becoming increasingly widespread and has become one of the key materials to meet the needs of modern electronic industry.

product overview

High performance PI copper plated filmIt is a product that uses high-quality polyimide film as the substrate and is coated with a uniform and dense copper layer on its surface through precision technology. This product has good conductivity, high temperature resistance, and chemical stability, and has shown great potential for applications in high-frequency circuit boards, flexible printed circuits, solar cells, and other fields.

Characteristics and advantages

1. Thickness can be customized: provided according to specific customer needs5 μ m to 125 μ mPI films of different thicknesses ensure that the product can meet the requirements of specific application scenarios.

2. Uniform and stable coating: Advanced coating technology is adopted to ensure uniform distribution and firm bonding of the copper layer, effectively improving the stability and reliability of the product.

3. Excellent electrical performance: The copper plated PI film has excellent conductivity and is suitable for high-frequency signal transmission and power transmission scenarios.

4. Wide applicability: Not only applicable to PI films, but also to the metallization treatment of other plastic film substrates, expanding the application range of the product.
   

Technical Parameter

1. Substrate material: High quality polyimide film

2. Coating material: pure copper or alloy copper

3. Thickness range: 5 μ m-125 μ m

4. Copper layer thickness: customizable

5. Thermal stability: up to 260 ° C

6. Tensile strength: ≥ 170MPa

7. Elongation at break: ≥ 5%

application area

1. Flexible circuit board: As the basic material of flexible circuit boards, it can withstand repeated bending without affecting performance.

2. Electromagnetic shielding: used in manufacturingelectromagnetic shielding materialEffectively block electromagnetic interference and ensure the normal operation of electronic devices.

3. Sensor: Produce high-precision sensors suitable for various environmental monitoring and industrial automation control.

4. New energy: The application of solar cells, lithium-ion batteries and other new energy fields to improve energy conversion efficiency.

Production process

1. Substrate preparation: High purity polyimide film is selected as the raw material.

2. Pre treatment: Clean and activate the surface of the film to improve the adhesion of the coating.

3. Coating process: Using vacuum coating, chemical plating and other technologies to uniformly deposit a copper layer on the surface of the film.

4. Post processing: Conduct quality inspection on the coated film to ensure the final quality of the product.
   

Quality Control and Service

We strictly follow the international standard production process and are equipped with advanced testing equipment to ensure that every rollPI copper plated filmAll meet high standards of quality requirements. In addition, we also provide professional technical support and a fast response service system to help customers solve various problems encountered during use.

conclusion

With the continuous advancement of electronic technology, high-performance PI copper plated films will play an important role in more fields. We are committed to providing our customers with the highest quality products and services, and working together to create a better future. If you have any needs or questions about PI copper plating film, please feel free to contact us for more information and support.