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Low temperature conductive copper paste plays a crucial role in modern electronics industry, especially in flexible electronic devices and devices that are not resistant to high temperatures. YB5106 low-temperature conductive copper paste from Yanbo brand is produced by Advanced Institute (Shenzhen) Technology Co., Ltd. It has the characteristics of high conductivity, good stability, and low temperature resistance, and is widely used in circuit boards, thin film switches, and various electronic devices. This article will explore how to effectively controlResearch Platinum Brand YB5106 Low Temperature Conductive Copper PasteThe curing time is set to ensure its optimal performance.
The curing temperature of low-temperature conductive copper paste is usually below 200 ° C, and some models can even achieve curing at room temperature. The curing process of YB5106 low-temperature conductive copper paste from Yanbo brand requires special attention to the coordination of curing temperature and time. Research has shown that with the increase of curing temperature and curing time, the electrical resistivity of copper paste after curing shows a trend of first rapidly decreasing and then remaining basically unchanged, while its adhesion gradually increases. Therefore, appropriate curing temperature and time are key to ensuring the performance of copper paste.
Determine the optimal curing temperature:
regardingResearch Platinum Brand YB5106 Low Temperature Conductive Copper PasteThe optimal curing temperature is usually between 150 ° C and 190 ° C. Through a large amount of experimental data, we found that 190 ° C is an ideal curing temperature that can ensure the curing effect of copper paste and avoid thermal stress on the substrate caused by excessive temperature.
Set a reasonable curing time:
At a curing temperature of 190 ° C, the optimal curing time for YB5106 low-temperature conductive copper paste from Yanbo brand is 20 minutes. During this period, the electrical resistivity of the copper paste drops to its lowest and the adhesion reaches its optimal state. If the curing time is too short and the copper paste is not completely cured, the conductivity and adhesion will be affected; If the curing time is too long, it may cause excessive hardening of the copper paste, affecting its adhesion to the substrate.
Conductive phase content:
The content of conductive phase has a significant impact on the conductivity and adhesion of copper paste. There is a percolation threshold (73.3 wt%), beyond which increasing the content of conductive phase does not significantly improve the conductivity of the film, but may instead reduce its adhesion. Therefore, in the preparation of YB5106 low-temperature conductive copper paste under the research platinum brand, it is necessary to strictly control the content of the conductive phase.
Selection of additives:
Moderate additives, such as Sn42Bi58 low melting point alloy powder, can enhance the conductivity and adhesion of cured copper based conductive films. However, excessive addition can actually lead to a decrease in the performance of the film. The Sn42Bi58 alloy powder with smaller particle size has better reinforcement effect, and its optimal mass ratio with copper powder is 1:3.
Mixing and dispersion:
During the preparation process,Conductive copper pasteThe uniformity of stirring and dispersion also has a significant impact on the curing time and curing effect. Ensuring sufficient mixing of powder with solvents, resins, and other components can optimize the curing process and improve the performance of copper paste.
Preheating treatment:
Before formal curing, the substrate can be preheated to improve the bonding strength between the copper paste and the substrate.
Monitoring the solidification process:
Using advanced temperature control equipment to monitor the temperature and time during the curing process in real time, ensuring the stability of the curing process.
Quality inspection:
After curing, conduct conductivity and adhesion tests on the copper paste to ensure that the product meets the design requirements.
By precisely controlling the curing temperature and time, as well as optimizing the content of conductive phases and the selection of additives, the performance of YB5106 low-temperature conductive copper paste from Yanbo brand can be significantly improved.Advanced Institute (Shenzhen) Technology Co., LtdWe have rich experience and technology in the research and production of low-temperature conductive copper paste, providing users with high-performance, stable and reliable conductive copper paste products. Through continuous technological innovation and process optimization, we will continue to contribute to the development of the electronics industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
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