Analysis of the production process of low-temperature sintered nano silver paste

With the development of electronic devices towards high performance, high power, and miniaturization, traditional connection materials such as lead-free solder andConductive adhesiveGradually unable to meet the high-temperature service requirements of high-power devices. Low temperature sintered nano silver paste has become a research hotspot in the field of high-power semiconductor device packaging due to its efficient connection under low-temperature conditions and special performance during high-temperature service. This article will provide a detailed introductionLow temperature sintering nano silver pasteThe production process is analyzed in depth through experimental data and reference data.

Production process of low-temperature sintering nano silver paste

1. Raw material preparation

The main component of low-temperature sintered nano silver paste is silver nanoparticles. The melting point of silver is 961 ℃, but at the nanoscale, its melting point will significantly decrease. Therefore, the interconnection of electronic products can be achieved through low-temperature sintering. In addition, silver has excellent thermal and electrical conductivity, as well as good chemical stabilitySemiconductor packagingThe ideal material.

2. Preparation process

The preparation of nano silver paste usually requires the addition of various organic compounds, including solvents, dispersants, and binders. These organic components play a crucial role in the preparation process of nano silver paste.

• Solvent: As a substrate for carrying nano silver particles, it regulates the viscosity and flowability of nano silver paste. Common solvents include Texanol ester alcohol, turpentine alcohol, cyclohexanedioctyl ester (IBCH), etc.
• Dispersant: Preventingnano silverReunion between them. Common dispersants include oils, polydiallyl dimethylammonium chloride (PDDA), polyacrylic acid (PAA), PSS, triethylene glycol, dodecylamine, dodecanol, nutmeg alcohol, etc.
• Adhesive: prevents cracking of nano silver paste during processing and sintering. Common adhesives include polyvinyl alcohol (PVA), PVB, EC, wax, etc.

3. Sintering process

Sintering technology is the process of forming dense crystals by diffusing atoms on the surface of materials at high temperatures. Low temperature sintering technology reduces the size of sintered particles and lowers the sintering temperature. The sintering temperature of nano silver paste is usually between 150 ℃ and 300 ℃, depending on the actual application requirements.

Experimental data analysis

In order to compare and analyze the sintering bonding strength between nano silver paste and micro silver paste, we conducted the following experiments:

• Experimental conditions: Under a pressure of 5MPa, nano silver paste and micro silver paste were sintered and connected to silver plated copper blocks.
• Experimental results: The shear strength of the nano silver paste sintered joint is more than 9 times that of the micro silver paste. This indicates that the nano silver paste has a significant shear strength advantage under low sintering pressure conditions.

In addition, through the analysis of the microstructure of the sintered joint, it was found that the sintered layer of the nano silver paste joint was well combined with the silver plating layer, and the sintered layer had a microporous structure with low porosity. Therefore, the thermal conductivity of the nano silver paste sintered layer is higher than that of the micro silver paste sintered layer, which helps to extend the service life of electronic devices.

Contribution of Advanced Institute (Shenzhen) Technology Co., Ltd

Advanced Institute (Shenzhen) Technology Co., Ltd. has achieved significant results in the research and production of nano silver paste. itsYanbo brand low-temperature sintered nano silver pasteIt has excellent thermal conductivity and high-temperature service performance, and is widely used in high-power LED packaging, MOSFET power devices, IGBT power devices and other fields.

conclusion

Low temperature sintered nano silver paste, as an emerging connecting material, has special properties of low-temperature connection and high-temperature service, which can meet the packaging requirements of high-power semiconductor devices. Through comparative analysis of experimental data and reference data, it has been demonstrated that the nano silver paste exhibits superior performance in terms of shear strength and thermal conductivity. The research platinum brand low-temperature sintered nano silver paste from Advanced Institute (Shenzhen) Technology Co., Ltd. provides strong guarantees for the high performance and reliability of electronic devices.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.