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Pressureless sintered silver pasteAs an advanced electronic packaging material, it plays an important role in the interconnection of semiconductor devices. The sintering temperature and time are key factors affecting the sintering quality and performance. This article aims to explore how to effectively control the sintering temperature and time of pressureless sintered silver paste, and conduct in-depth analysis through reference data and experimental data, while also mentioningAdvanced Institute (Shenzhen) Technology Co., LtdContribution in the field of pressureless sintered silver paste.
The sintering process of pressureless sintered silver paste mainly includes three stages: particle rearrangement, neck growth, and pore spheroidization reduction. During this process, the sintering temperature and time directly affect the diffusion rate of silver particles and the formation of sintering necks, which in turn affect the density and conductivity of the sintered body.
The increase in sintering temperature promotes the diffusion of silver particles and the formation of sintering necks, thereby improving the density and conductivity of the sintered body. However, excessively high sintering temperatures may also lead to excessive growth of the sintered body, resulting in cracks and deformation.
Research has shown that as the sintering temperature increases, the density and hardness of the sintered body gradually increase. For example, within the sintering temperature range of 200 ℃ to 300 ℃, the porosity of the sintered body significantly decreases, while the circumference and particle size of the sintered network significantly increase. The specific data is as follows:
In addition, increasing the sintering temperature will also enhance the thermal conductivity of sintered silver blocks. The thermal conductivity of silver block sintered at 280 ℃ can reach 276W/(m · K).
In order to effectively control the sintering temperature, the following strategies can be adopted:
The extension of sintering time helps to facilitate the full diffusion of silver particles and the complete formation of sintering necks, thereby improving the density of the sintered body. However, excessively long sintering time may also lead to energy waste and overburning of the sintered body.
Experimental data shows that extending the insulation time can significantly reduce the porosity of the sintered body and increase the circumference of the sintered network. For example, extending the insulation time from 0 minutes to 120 minutes resulted in a 36.5% decrease in porosity, a 59.0% decrease in sintering network circumference, and a 91.7% increase in particle size.
In order to reasonably control the sintering time, the following measures can be taken:
Advanced Institute (Shenzhen) Technology Co., LtdPressureless sintered silver pasteWe have conducted in-depth research in the field and developed high-performance pressureless sintered silver paste products. The company has achieved precise control over sintering temperature and time by optimizing sintering processes and formulas, thereby improving the density and conductivity of the sintered body. Its products have been widely used in fields such as semiconductor packaging and LED lighting, and have received unanimous praise from customers.
The sintering temperature and time of pressureless sintered silver paste are key factors affecting its performance. By precisely controlling the sintering temperature and time, high-density and highly conductive sintered bodies can be obtained. The contribution of Advanced Institute (Shenzhen) Technology Co., Ltd. in the field of pressureless sintered silver paste has provided strong support for the development of electronic packaging technology. In the future, with the continuous advancement of technology and the continuous optimization of processes, the performance and application scope of pressureless sintered silver paste will continue to expand.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
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