Epoxy resin conductive adhesive for semiconductor packaging - surpassing traditional packaging materials

1、 The problem of traditional packaging materials

1. Poor thermal conductivity

　　Traditional packaging materialsIn high-power packaging, there is often a problem of heat dissipation, where heat is difficult to quickly conduct and can easily lead to high chip temperatures, affecting chip performance and lifespan.

2. Limited mechanical strength

Packaging materials often need to withstand significant forces during the packaging process, and traditional packaging materials have limited mechanical strength, which can easily cause cracking or deformation of the packaging material.

3. Poor conductivity

Need to use in semiconductor packagingConductive adhesiveTo connect chips and packaging substrates, traditional conductive adhesives have limited conductivity and are prone to wire breakage or signal transmission delay.

2、 Advantages of epoxy resin conductive adhesive

1. Excellent thermal conductivity performance

Epoxy resin conductive adhesive has high thermal conductivity, which can quickly transfer the heat generated by the chip to the packaging substrate, improve heat dissipation efficiency, effectively reduce chip temperature, and ensure the normal operation of the chip.

For example, a study showed that power amplifiers packaged with epoxy resin conductive adhesive have a 30% decrease in temperature and a 15% increase in power output compared to traditional packaging materials.

2. Strong mechanical strength

　　Epoxy resin conductive adhesiveHas excellent mechanical strength, can withstand large pressures and impacts, ensuring the stability and reliability of packaging materials.

Reference data: An experiment showed that chips packaged with epoxy resin conductive adhesive can still maintain good connection after 1000 repeated folding tests, while traditional packaging materials may experience wire breakage or loose connections.

3. Excellent conductivity

Epoxy resin conductive adhesive can provide low resistance and stable current transmission, ensuring good electrical connection between the chip and the packaging substrate, and reducing signal transmission delay.

For example, a test showed that chips connected with epoxy resin conductive adhesive have stable conductivity without impedance changes or current leakage. Compared with traditional conductive adhesive, the signal transmission delay is reduced by 25%.

3、 The development direction of epoxy resin conductive adhesive

1. High precision packaging

At present,Epoxy resin conductive adhesiveIt has been widely used in fields such as smartphones, electronic vehicles, and medical devices, and is expected to achieve high-precision packaging of smaller chips in the future, improving packaging efficiency and reliability.

2. Low temperature packaging

With the development of semiconductor technology, the performance requirements for packaging materials in low-temperature environments are also increasing. Epoxy resin conductive adhesive has great potential in low-temperature packaging, and research and development will be strengthened in the future to meet packaging needs in various extreme environments.

3. Environmentally friendly materials

Epoxy resin conductive adhesive is more environmentally friendly compared to traditional packaging materials, does not contain harmful substances, and is environmentally friendly. The future research and development direction will further improve the biodegradability and recyclability of epoxy resin conductive adhesive, achieving sustainable development.

In short, epoxy resin conductive adhesive used in semiconductor packaging is unique in the field of semiconductor packaging due to its excellent thermal conductivity, strong mechanical strength, and excellent conductivity. In the future, epoxy resin conductive adhesive will have a broader development space, providing strong support for the progress and application of semiconductor packaging technology.