What is the applicability of viscosity and flowability of filling gold paste in high-density drilling operations

1. Introduction

In the semiconductor manufacturing process, hole filling gold paste is widely used for through-hole filling, pad connection, and as part of the conductive path. Good hole filling accuracy not only affects electrical performance, but also relates to the reliability and service life of the product. Therefore, it is crucial to choose the appropriate filling gold paste material. This article will focus onYanbo brand YB8106 filling gold pasteFor example, analyze its characteristics and application effects.

2. Introduction to YB8106 pore filling gold paste from Yanbo brand

2.1 Material Composition and Characteristics

YB8106 pore filling gold paste from Yanbo brand is carefully formulated with high-purity metal powder, organic carrier, and other additives. It has excellent rheological properties, excellent thermal and chemical stability, and can achieve efficient sintering solidification at lower temperatures while maintaining high conductivity and mechanical strength.

2.2 Technical advantages

• High precision hole filling: By optimizing formula design and process parameters, it ensures that even small holes can be fully and uniformly filled.

• Excellent adhesion: enhances the bonding force between the gold paste and the substrate material, reducing the risk of delamination or peeling.

• Low shrinkage rate: effectively controls the volume change during sintering process, avoiding defects caused by uneven shrinkage.

• Environmentally friendly: Compliant with RoHS standards, does not contain harmful substances such as lead, and supports the concept of green manufacturing.

3. Requirements for hole filling accuracy in semiconductor manufacturing

3.1 Micro refinement trend

As the feature size of integrated circuits continues to shrink and the line spacing becomes narrower, this requiresFilling gold pasteIt must have extremely high resolution and consistency to adapt to structures at the micrometer or even nanometer level.

3.2 Reliability considerations

In addition to the accuracy of physical dimensions, it is also necessary to ensure long-term reliability, that is, to maintain stable electrical performance and mechanical integrity under various environmental conditions.

4. Application case and test results of YB8106 filling gold paste

4.1 Practical Application Cases

Advanced Institute (Shenzhen) Technology Co., Ltd. has successfully used Research Platinum brand YB8106 filling gold paste in multiple projects, including but not limited to high-performance computing chips, 5G communication modules, and other fields. These applications demonstrate that the product can still provide excellent hole filling accuracy and service life in complex environments.

4.2 Comparison of Test Data

By observing different batches of samples using SEM scanning electron microscopy and X-ray tomography, the results showed thatYB8106 filling gold pasteExcellent performance in various tests, especially in minimizing porosity, far exceeding the industry average and achieving the expected pore filling accuracy target.

5. Conclusion

In summary, based on the research achievements and technological accumulation of Advanced Institute (Shenzhen) Technology Co., Ltd., Yanbo brand YB8106 filling gold paste has demonstrated extremely high filling accuracy and reliability in the semiconductor manufacturing field with its unique advantages, fully meeting the industry's demand for fine interconnect materials in the current and future period. With the development of technology, it is believed that more innovative solutions will emerge, further promoting the progress of the entire industry.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.