Low temperature cured copper alloy conductive adhesive: promoting new breakthroughs in electronic technology

With the rapid development of technology, the application of high-performance materials in the electronics industry is becoming increasingly widespread. Among them, conductive adhesive plays an important role in the manufacturing of electronic components as a key material. However, traditional conductive adhesives face many limitations during use, such as easy oxidation during high-temperature curing, high cost, and low production efficiency. To address these issues, a new type ofLow temperature cured copper alloy conductive adhesiveAs a result, it not only solves the shortcomings of traditional conductive adhesives, but also makes significant breakthroughs in performance and cost.

1、 Characteristics of Low Temperature Curing Copper Alloy Conductive Adhesive

1.1 Strong antioxidant activity

Traditional copper based conductive adhesives are prone to oxidation during high-temperature curing, leading to a decrease in conductivity. Low temperature cured copper alloy conductive adhesive can be cured under low temperature conditions by adding special antioxidants, significantly reducing the risk of oxidation and ensuring long-term stability and reliability.

1.2 High cost-effectiveness

Compared toPure silver based conductive adhesiveThe cost of copper alloy conductive adhesive is significantly lower. Through carefully designed formulas, excellent conductivity can be maintained while significantly reducing the use of precious metals, thus achieving higher cost-effectiveness.

1.3 Rapid curing

Low temperature cured copper alloy conductive adhesive can achieve rapid curing at lower temperatures, which not only reduces energy consumption but also greatly improves production efficiency. By using a specific combination of curing agents, the conductive adhesive can achieve good cross-linking effect at lower temperatures (usually below 100 ° C).

2、 Preparation method of low-temperature cured copper alloy conductive adhesive

2.1 Raw material selection

Low temperature cured copper alloy conductive adhesiveThe main raw materials include epoxy resin, curing agent, diluent, antioxidant, etc. Specifically:

• Epoxy resin: Use resin with an epoxy value between 40-60 equivalents/100g as the matrix.
• Curing agent: amine and anhydride curing agents are used in combination to achieve good synergistic effects.
• Diluent: Anhydrous ethanol is used to adjust viscosity.
• Antioxidants: Choose appropriate antioxidants to improve the stability of materials.

2.2 Preparation process

• Raw material mixing: First, mix epoxy resin, curing agent, diluent, and antioxidant in a certain proportion evenly to make a matrix solution.

• Conductive filler addition: Select copper alloy powder with suitable particle size and disperse it into the matrix solution to ensure uniform distribution.

• Stirring and mixing: copper alloy powder is uniformly dispersed in the matrix by high-speed stirring.

• Defoaming treatment: Use vacuum degassing equipment to remove bubbles from the mixed liquid.

• Curing: Apply the mixture onto the workpiece and complete the curing process at a set temperature.

3、 Application prospects of low-temperature cured copper alloy conductive adhesive

3.1 Consumer Electronics Products

In consumer electronics products such as smartphones, tablets, and laptops, low-temperature cured copper alloy conductive adhesive can be used for battery connection, touch screen bonding, circuit board soldering, and other processes to improve product performance and reliability.

3.2 Smart Wearable Devices

Wearable products such as smartwatches and health monitoring devices have high requirements for conductive adhesive. Low temperature cured copper alloy conductive adhesive, with its excellent performance, can better meet the usage needs of these products.

3.3 New Energy Vehicles

With the rapid development of the new energy vehicle industry, the demand for efficient and reliable conductive materials is also increasing. Low temperature cured copper alloy conductive adhesive can be used for key components such as automotive battery management systems and motor control systems, helping to improve overall performance.

conclusion

Low temperature cured copper alloy conductive adhesiveWith its unique performance advantages, it not only solves the problems of traditional conductive adhesives, but also provides more advanced and efficient solutions for the electronics industry. With the advancement of technology and the growth of market demand, this conductive adhesive is bound to have broader application prospects.