How to choose the appropriate resin matrix and conductive filler to manufacture high-temperature resistant conductive adhesive?

High temperature resistant conductive adhesiveIt has a wide range of applications in fields such as electronic packaging, aerospace, metallurgy, and petroleum industry. Choosing the appropriate resin matrix and conductive filler is the key to manufacturing high-temperature resistant conductive adhesive. This article will explore in detail how to choose suitable resin matrix and conductive filler to prepare high-performance high-temperature resistant conductive adhesive.

1. Introduction

High temperature resistant conductive adhesive as a highly reliable and environmentally friendly typeNew adhesive materialsIt has received widespread attention. The resin matrix and conductive filler are the main components of high-temperature conductive adhesive, and their selection directly affects the performance of the conductive adhesive. Advanced Institute Technology will conduct a detailed discussion on the selection of resin matrix and conductive filler.

2. Selection of resin matrix

2.1 High temperature resistance performance

High temperature resistant conductive adhesive needs to maintain stability in high temperature environments for a long time, so it is crucial to choose a resin matrix with high temperature resistance performance. commonHigh temperature resistant resin matrixIncluding bisphenol A cyanate ester, dicyclopentadiene bisphenol cyanate ester, multifunctional cyanate ester, etc. These materials can remain stable under high temperature conditions and will not decompose.

2.2 Adhesive performance

The bonding performance of the resin matrix determines the bonding strength of the conductive adhesive. When selecting a resin matrix, materials with strong bonding properties should be chosen to ensure that the conductive adhesive can maintain good bonding strength under high temperature conditions. For example, bisphenol A cyanate ester has good bonding properties and is suitable for manufacturing high-temperature conductive adhesives.

2.3 Chemical stability

High temperature resistant conductive adhesiveIt is necessary to choose a resin matrix with good chemical stability to maintain stability in various environments. For example, dicyclopentadiene bisphenol cyanate ester has good chemical stability and can resist the influence of environmental factors such as acid, alkali, and salt.

3. Selection of conductive fillers

3.1 Conductivity Performance

The conductivity of conductive fillers directly affects the conductivity of conductive adhesives. When selecting conductive fillers, materials with excellent conductivity, such as micron silver powder, should be chosennano-silverSilver plated powder, etc. Silver plated powder can be silver plated copper powder, silver plated nickel powder, silver plated aluminum powder, etc.

3.2 Particle size

The particle size of conductive fillers has a significant impact on their dispersion in the resin matrix and the conductivity of conductive adhesives. If the particle size is too small, it will cause the viscosity of the conductive adhesive to be too high, which is not conducive to construction; Excessive particle size can lead to a decrease in the conductivity of the conductive adhesive. Generally speaking, the particle size range of micrometer silver powder is 1-100 μ m, and the particle size range of nanometer silver powder is 10-100nm.

3.3 Surface Treatment

To improve the compatibility between conductive fillers and resin matrix, surface treatment such as silver plating can be applied to the conductive fillers. The surface treated conductive filler can better bond with the resin matrix and improve the performance of the conductive adhesive.

4. Comprehensive consideration

When choosing resin matrix andconductive fillerAt the same time, other performance requirements of the conductive adhesive need to be comprehensively considered, such as fluidity, curing speed, acid alkali salt resistance, etc. In addition, cost is also an important factor to consider. By selecting and matching resin matrix and conductive filler reasonably, high-performance high-temperature resistant conductive adhesive can be prepared to meet the needs of different fields.

5. Conclusion

Choosing the appropriate resin matrix and conductive filler is the key to manufacturing high-temperature resistant conductive adhesive. When selecting a resin matrix, its high temperature resistance, bonding performance, and chemical stability should be considered; When selecting conductive fillers, their conductivity, particle size, and surface treatment should be considered. By selecting and matching resin matrix and conductive filler reasonably, high-performance high-temperature resistant conductive adhesive can be prepared to meet the needs of different fields.