Copper plated polymer film: Innovative preparation technology and application of Advanced Institute (Shenzhen) Technology Co., Ltd

With the increasing trend of electronic products towards lightweight and high-performance, the demand for new materials has also increased. Copper plated polymer films, as an important functional material, have broad application prospects in flexible circuit boards (FPCs), electromagnetic shielding, conductive substrates, and other fields. In order to meet market demand,Advanced Institute (Shenzhen) Technology Co., LtdWe have developed an innovative method for preparing copper plated polymer films, which can effectively improve the conductivity, mechanical strength, and corrosion resistance of the films.

Technical background

Traditional copper plating processes often suffer from high costs, environmental pollution, and poor adaptability to flexible substrates. In order to solve these problems, Advanced Institute (Shenzhen) Technology Co., Ltd. has adopted a new method combining electrodeposition technology and chemical plating technology to prepareCopper plated polymer filmThis method can not only significantly reduce production costs, but also improve the quality of the coating.

Preparation Method

The preparation method of copper plated polymer film by Advanced Institute (Shenzhen) Technology Co., Ltd. mainly includes the following steps:

1. Substrate preparation: PET (polyethylene terephthalate) is selected as the substrate, and surface impurities are removed through pretreatment to improve the adhesion of subsequent coatings.

2. Catalytic layer deposition: depositing a layer of catalyst (such as palladium or nickel) on the surface of the substrate as a follow-upElectroless CopperThe foundation.

3. Chemical copper plating: Copper is deposited on the surface of a substrate through a chemical reduction reaction in a solution containing copper ions. In this step, copper ions are reduced to metallic copper under the action of a catalyst and uniformly deposited on the substrate.

4. Electrodeposition thickening: To further improve the thickness and conductivity of the copper layer, electroplating technology is used to further thicken the copper layer on the basis of chemical copper plating.

5. Post processing: FinallyCopper plated filmPerform post-processing steps such as cleaning and drying to ensure product quality.

formulation

The preparation formula for copper plated polymer film is as follows:

• Substrate: PET film, thickness of 25 μ m, width can be customized according to customer needs.
• Catalyst layer: palladium salt solution, concentration of 0.01 g/L; The sedimentation time is 5 minutes.
• Chemical copper plating solution: containing 50g/L copper sulfate (CuSO ₄), 30g/L sodium hypophosphite (NaH ₂ PO ₂), as well as appropriate chelating agents and stabilizers, with a pH value adjusted to around 9.
• Electrodeposited liquid: Copper sulfate as the main salt, with a concentration of 200g/L; Sulfuric acid is a conductive salt with a concentration of 50g/L; And add an appropriate amount of brightener and wetting agent, with a current density of 1-2 A/dm ² and a deposition time of 30 minutes.
• Post treatment: The cleaning agent is deionized water, the drying temperature is 80 ° C, and the time is 10 minutes.

Product parameters

• Thickness: The total thickness can reach 50 μ m, with a copper layer thickness of approximately 25 μ m.
• Conductivity: Surface resistivity ≤ 0.01 Ω/sq.
• Mechanical strength: Tensile strength ≥ 100 MPa.
• Corrosion resistance: Through salt spray testing, continuous exposure to 5% NaCl solution for 72 hours showed no significant corrosion phenomenon.
• Flexibility: After 1000 bending tests, the copper layer does not crack.

empirical test

In order to verify the performance of copper plated polymer films, the following experiments were conducted:

• Conductivity test: The resistivity of the film was measured using the four probe method, and the results showed that its conductivity was good.
• Mechanical strength testing: The tensile strength of the film was tested using a tensile testing machine, and the results showed that its strength was high.
• Corrosion resistance test: Place the sample in a salt spray box for corrosion resistance testing to ensure its stable performance in harsh environments.
• Flexibility test: Conduct repeated bending tests on the sample to verify its flexibility and stability of the copper layer.

conclusion

With the continuous advancement of electronic technology, the requirements for materials are becoming increasingly high. Developed by Advanced Institute (Shenzhen) Technology Co., LtdCopper plated polymer filmWith its unique technological advantages and excellent performance, it has brought new solutions to the industry. In the future, with the advancement of materials science and optimization of production processes, we have reason to believe that copper plated polymer films will play an important role in more fields, driving electronic material technology to new heights.