New type of conductive silver adhesive for chip bonding: achieving efficient and reliable bonding

With the rapid development of electronic technology, chip bonding technology plays a crucial role in electronic packaging. In order to achieve higher adhesive reliability and performance, a new type ofConductive silver adhesiveemerge as the times require. This article will introduce the advanced technology of epoxy resin matrix, mica curing agentMicron level silver powderDiscuss the adhesive effect of conductive silver paste composed of reactive diluent system and its application in lead frame and LGA packaging.

Adhesive reliability and performance: advantages of conductive silver adhesive

Conductive silver adhesive, as a new type of bonding material, has multiple excellent properties. Firstly, theConductive silver adhesiveThe volume resistivity at room temperature is 3.7x10 "· cm, indicating its good conductivity and ability to meet the conductivity requirements of high-precision electronic devices. Secondly, conductive silver paste has a good shelf life of over 48 hours, ensuring stability during long-term use. In addition, the viscosity of the conductive silver paste is moderate, making it easy to apply and process. Finally, it also has excellent heat resistance and heat dissipation performance, which can withstand working in high-temperature environments and effectively dissipate heat without causing the chip to overheat.

Applied to lead frames: reliability assessment

To verify the adhesive performance of conductive silver paste in lead frames, we used this method for different framesConductive silver adhesiveAdhesive bonding was carried out and reliability testing was conducted. The results showed that the conductive silver adhesive had the best adhesion to the uncoated frame, but there was not much difference in adhesion between the frames at high temperatures. This indicates that the conductive silver adhesive can be stably bonded to the lead frame, maintaining good adhesion performance regardless of whether there is a coating or not.

Applied to LGA packaging: benefits of no bubbles and delamination phenomenon

We also applied conductive silver adhesive to the bonding of LGA packaged chips and investigated its effectiveness. Fortunately, we did not observe any bubbles or delamination in the encapsulated interface. This means that the conductive silver adhesive forms a tight bond between the silicon chip and the substrate, effectively avoiding medium separation and local ventilation problems, and improving the quality and reliability of chip packaging.

Conclusion: Application potential and prospects of conductive silver paste

Overall, the conductive silver adhesive used for bonding new chips has excellent conductivity, stable shelf life, moderate viscosity, and good heat dissipation performance. Through application investigation in lead frames and LGA packaging, we found that conductive silver adhesive can achieve reliable bonding effect and has the ability to withstand high temperature environments. In the future, with the continuous development of electronic packaging technology, conductive silver adhesive is expected to become one of the preferred materials for chip bonding, making important contributions to the performance improvement and reliability enhancement of electronic devices.