Innovative application of high-temperature co fired AlN multilayer wiring substrate filled with tungsten paste for hole filling

In today's rapidly advancing technology, High Temperature Co fired Ceramics (HTCC) technology plays a crucial role in the fields of electronic packaging and integrated circuits due to its excellent high-temperature resistance, high stability, and outstanding electrical performance. Among them, aluminum nitride (AlN), as a key material in HTCC technology, has become the preferred choice for multi-layer wiring substrates due to its high thermal conductivity, low thermal expansion coefficient, and excellent mechanical properties. However, the filling process has always been a technical challenge in the manufacturing process of AlN multilayer wiring substrates.

In order to meet this challenge, Advanced Institute Technology has successfully launched a product designed specifically for high-temperature co fired AlN multilayer wiring substrates through unremitting research and developmentFill hole tungsten pasteThis hole filling tungsten paste not only has excellent fluidity to ensure uniform filling of holes in complex wiring structures, but also has extremely high sintering stability and reliability, which can maintain the stability of its structure and performance in high temperature environments.

Behind the research and development of hole filling tungsten paste is the deep understanding and exquisite control of material science, process technology, and production processes by advanced institute technology. Firstly, in terms of material selection, tungsten, as a high melting point and high hardness metal, has excellent conductivity and thermal stability, making it an ideal choice for filling holes. By carefully adjusting the particle size, morphology, and dispersibility of tungsten powder, Advanced Institute Technology has successfully prepared pore filling tungsten paste with excellent performance.

In terms of process technology, the preparation of pore filling tungsten paste requires multiple fine processes. From the screening and mixing of raw materials to the grinding and dispersion of the slurry, every step needs to be strictly controlled to ensure the quality and performance of the filling tungsten slurry. At the same time, during the filling process, Advanced Institute Technology adopts advanced automation equipment and precise control systems to ensure that the filling tungsten paste can be accurately and evenly filled into each hole.

exceptFill hole tungsten pasteIn addition to its own quality and performance, its application effect in high-temperature co fired AlN multilayer wiring substrates is also a key indicator to measure its success. In practical applications, filling tungsten paste can not only effectively fill holes and improve the overall performance of the substrate, but also form a good bond with AlN substrate, ensuring the stability and reliability of the substrate. At the same time, the introduction of hole filling tungsten paste can optimize the thermal conductivity of the substrate, reduce temperature fluctuations during operation, and improve the stability and reliability of the circuit.

It is worth mentioning that Advanced Institute Technology has fully considered the requirements of environmental protection and sustainable development in the research and development process of filling tungsten paste. By optimizing raw material sources, improving production processes, and reducing energy consumption and emissions, Advanced Institute Technology has successfully achieved green manufacturing of pore filling tungsten slurry. This not only reflects the emphasis of advanced technology on environmental responsibility, but also contributes to the sustainable development of electronic packaging and integrated circuits.

In short,Advanced Institute of TechnologyThe high-temperature co fired AlN multilayer wiring substrate filled with tungsten paste is an innovative and practical product. It not only solves the technical problems in traditional hole filling processes, but also improves the overall performance and stability of AlN multilayer wiring substrates. With the continuous development of electronic packaging and integrated circuit technology, the application prospects of hole filling tungsten paste will be even broader.