Control method for electromigration phenomenon of PI silver plated film

With the development of the electronics industry, polyimide (PI) materials have been widely used in flexible electronic devices due to their excellent mechanical properties, heat resistance, and chemical stability. Silver plating treatment on the surface of PI can significantly improve its conductivity, but it also brings about the problem of electromigration. This article explores the phenomenon of electromigration and its impact onPI silver plated filmThe impact was discussed, and the research progress and solutions of Advanced Institute (Shenzhen) Technology Co., Ltd. in this field were introduced.

1. Introduction

Electromigration refers to the phenomenon of metal atoms moving at the microscopic level when current passes through a metal thin film. For silver plating on PI substrates, electromigration may cause circuit breakage or short circuit, affecting the reliability of the equipment. Therefore, how to effectively control electromigration has become one of the key challenges in improving product performance.

2. Electromigration mechanism

Electromigration is mainly caused by the following factors:

• High current density: When the current density is too high, the electron flow will generate a significant thrust on the metal ions.
• Temperature gradient: Temperature differences can cause thermal stress, further intensifying the movement of metal atoms.
• Material defects, such as grain boundaries, pores, and other microstructural characteristics, can accelerate the process of electromigration.

3. Control strategy

In response to the above issues,Advanced Institute (Shenzhen) Technology Co., LtdA series of effective control measures have been proposed:

3.1 Material selection and pretreatment

Choose alloys with better resistance to electromigration as coating materials instead of pure silver. In addition, optimizing the surface treatment process of PI substrates, such as plasma cleaning and nanoscale roughness treatment, to enhance coating adhesion and reduce interface defects.

3.2 Process Improvement

By using advanced physical vapor deposition (PVD) technology instead of traditional chemical plating methods, the thickness and uniformity of the coating can be more accurately controlled; Simultaneously utilizing a multi-layer composite structure design, a barrier layer (such as titanium or chromium) is inserted between the silver layers to prevent silver atoms from diffusing vertically.

3.3 Environmental Management

Strictly control the temperature and humidity conditions in the production environment to avoid additional stress changes caused by external factors. Use packaging materials with good heat dissipation to reduce the accumulation of heat generated during operation.

3.4 Design Optimization

Reasonably plan the circuit layout to ensure even current distribution and avoid local overload; Appropriately increase the line width to disperse the current intensity; Introducing redundant path design ensures that even if a fault occurs in one area, it will not affect the overall functionality.

4. Conclusion

Through comprehensive consideration of materials, processes, environment, and design, Advanced Institute (Shenzhen) Technology Co., Ltd. has successfully developed a complete set ofPI silver plated filmElectromigration control scheme. This not only solves many problems in traditional craftsmanship, but also provides solid technical support for the development of high-performance flexible electronic products in the future.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.