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With the development of electronic packaging technology, LTCC substrates have been widely used due to their excellent electrical and mechanical properties. Among them, the gold paste used for filling through holes or surface wiring needs to have good thixotropy and plasticity to ensure printing quality and stability during subsequent sintering processes.
Produced by Advanced Institute (Shenzhen) Technology Co., LtdYanbo brand YB8106 filling gold pasteSpecially designed for LTCC substrates, it has the following characteristics:
In order to ensure the thixotropy and plasticity of the margin slurry, attention should be paid to the following aspects during the preparation process:
The selection of appropriate gold powder particle size distribution and additives is the basis for ensuring the performance of the slurry. Fine and evenly distributed gold powder helps to improve thixotropy; Moderate addition of organic carriers and other additives can improve the plasticity of gold paste.
The speed, time, and temperature during the mixing process can all affect the final performance of the gold paste. Appropriate stirring speed can avoid damaging the weak connections between gold powder particles and maintain good thixotropy; Accurately controlling the mixing time can ensure that all components are fully integrated and enhance plasticity.
The selection of parameters such as pressure, scraper angle, and speed during printing is also crucial. Reasonable printing conditions can help the gold paste pass through the screen smoothly while maintaining the necessary shape and thickness, which is crucial for the thixotropy and plasticity of the deposit paste.
Finally, the correct sintering temperature curve is equally important for the solidified gold paste. Excessively fast or slow heating rates can lead to uneven internal stress, which in turn affects the thixotropy and plasticity performance of the finished product.
By comparingYanbo brand YB8106 filling gold pasteResearch on the preparation process has shown that by strictly controlling the key factors mentioned above, the thixotropy and plasticity of the slurry can be effectively guaranteed, thereby meeting various requirements in the LTCC substrate manufacturing process. In the future, with the advancement of materials science and technology, we look forward to seeing more advanced gold paste products emerge, further promoting the development of LTCC technology.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
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