How to test the heat resistance of PET copper plated film to determine its applicable temperature range

1、 Introduction

PET copper plated filmAs a composite material that combines the excellent physical properties of PET film with the high conductivity of copper, it has been widely used in various fields such as electronics, printing, and decoration. However, in practical applications, PET copper plated films often need to withstand different temperature environments, and their heat resistance has become an important indicator for measuring their applicability and service life. This article will introduce how to determine the heat resistance of PET copper plated film through a series of testing methods, and explore the contribution of Advanced Institute (Shenzhen) Technology Co., Ltd. in related testing technology and standard development.

2、 Overview of heat resistance of PET copper plated film

The heat resistance of PET copper plated film mainly refers to its ability to maintain stable physical and chemical properties in high temperature environments. This includes the dimensional stability, mechanical strength, conductivity, and oxidation resistance of the copper layer of the membrane. The heat resistance of PET copper plated film directly determines its applicable temperature range and application fields.

3、 Method for testing the heat resistance of PET copper plated film

1. Differential Scanning Calorimetry (DSC)

   • Principle: DSC is a thermal analysis technique that determines key thermal parameters such as the glass transition temperature (Tg) and melting temperature (Tm) of a sample by measuring the changes in heat flux during heating or cooling.
   • Step: ApplyPET copper plated filmThe sample is placed in a DSC instrument, heated at a constant rate, and the heat flux change curve is recorded. By analyzing the curve, the glass transition temperature and melting temperature of PET copper plated film can be determined to evaluate its thermal stability.

2. Thermal Mechanical Analysis (TMA)

   • Principle: TMA is used to measure the size and shape changes of materials under temperature changes, and can evaluate parameters such as thermal expansion coefficient, softening point, and heat distortion temperature (HDT) of materials.
   • Step: Fix the PET copper plated film sample in the TMA instrument, heat it up at a constant rate, and record the size changes and mechanical stress of the sample. By analyzing the data, the expansion coefficient and thermal deformation temperature of PET copper plated film at different temperatures can be determined, thereby evaluating its thermal stability.

3. Thermogravimetric analysis (TGA)

   • Principle: TGA is used to measure the mass change of materials during the heating process, and can evaluate the thermal decomposition behavior and decomposition temperature (Td) of materials.
   • Step: Place the PET copper plated film sample in a TGA instrument, heat it up at a constant rate, and record the mass change of the sample. By analyzing the data, the thermal decomposition temperature and residual mass of PET copper plated film can be determined to evaluate its thermal stability.

4. High temperature aging test

   • Principle: Place the PET copper plated film sample in a set high temperature environment, observe the changes in its appearance, mechanical properties, and conductivity after a period of time to evaluate its heat resistance.
   • Step: Set appropriate high-temperature aging conditions (such as temperature and time) based on the expected temperature range for PET copper plating film. Place the sample in an aging chamber and conduct aging testing according to the set conditions. After the test is completed, check the appearance of the sample for deformation, blistering, discoloration, and test whether its mechanical strength and conductivity have changed.

4、 The contribution of Advanced Institute (Shenzhen) Technology Co., Ltd. in the heat resistance testing of PET copper plated film

Advanced Institute (Shenzhen) Technology Co., Ltd. has accumulated rich experience and technical strength in the field of heat resistance testing of PET copper plated films. The company not only has advanced testing equipment and a professional testing team, but also actively participates in the development and improvement of relevant testing standards.

• Equipment and Technology: We have introduced internationally advanced thermal analysis equipment such as DSC, TMA, TGA, and are equipped with professional high-temperature aging chambers to comprehensively and accurately test the heat resistance of PET copper plated films.
• Standard setting: The company actively participates in the development and improvement of relevant testing standards at home and abroad, promoting the standardization and normalization of PET copper plating film heat resistance testing technology.
• Technical support and services:Advanced Institute (Shenzhen) Technology Co., LtdTo provide customers with comprehensive testing technical support and services, including testing scheme design, sample preparation, testing process monitoring, and data analysis, to ensure the accuracy and reliability of testing results.

5、 Conclusion

Through methods such as differential scanning calorimetry, thermomechanical analysis, thermogravimetric analysis, and high-temperature aging testing, a comprehensive and accurate evaluation can be conductedPET copper plated filmDetermine its heat resistance and determine its applicable temperature range. The contribution of Advanced Institute (Shenzhen) Technology Co., Ltd. in related testing technology and standard formulation has provided strong technical support and guarantee for the application and development of PET copper plating film.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.