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Frontier News

New breakthrough in thin film gold plating technology: creating the next generation of conductive and shielding materials

Time:2024-08-15Number:701

In today's rapidly advancing technology, the innovative application of various materials is an important driving force for the development of the industry. Especially with the trend of electronic products developing towards slimness and intelligence, the requirements for material performance are also increasing. In this context,PI Gold Plating Film TechnologyThe latest developments have attracted widespread attention from the industry.Advanced Institute of TechnologyThis article will explore how this cutting-edge technology has become a new favorite in the fields of conductive materials and shielding materials.

Overview of PI Gold Coating Technology

PI gold plating technology refers to depositing one or more layers of gold film on the surface of polyimide film, forming a highly conductive andGood electromagnetic shielding performanceComposite materials. Due to the excellent mechanical properties, thermal stability, and chemical stability of polyimide itself, coupled with the high conductivity and excellent corrosion resistance of gold, PI gold plating film has broad application prospects in fields such as electronics, aerospace, and automobiles.
镀金膜

Innovation points of PI gold plating film technology

1. Improvement of thin film gold plating technology

In recent years, there have been significant advances in gold plating technology. The new chemical gold plating process can achieve a more uniform and thinner gold layer coating, which not only reduces material costs but also improves material performance. The uniformity of the gold layer directly affects the conductivity and shielding effect of the material. The better the uniformity, the more stable the material's performance.

2. New applications of conductive materials

In electronic devices, the performance of conductive materials directly affects the signal transmission efficiency and electromagnetic compatibility of the equipment.PI gold-plated filmDue to its excellent conductivity, it is widely used in fields such as flexible circuit boards, flexible displays, and wearable devices. This material can not only replace traditional rigid circuit boards, but also achieve more complex designs and higher integration.

3. New breakthroughs in shielding materials

With the development of wireless communication technology, electromagnetic interference problems are becoming increasingly serious. The PI gold plating film performs well in shielding electromagnetic waves, and its gold layer can effectively reflect and absorb electromagnetic waves, reducing electromagnetic interference. This feature makes it irreplaceable in the field of electromagnetic compatibility (EMC), especially suitable for high demand areas such as aerospace and military communications.
镀金膜

Market prospects of PI gold plating film technology

With the promotion of 5G communication technology and the popularity of IoT devices, the demand for high-performance conductive and shielding materials is increasing day by day. PI gold-plated film technology, with its unique performance advantages, is gradually becoming the darling of the market. In addition, with the optimization of production processes and further cost reduction, PI gold plating film is expected to be applied in more fields, such as smart cards, electronic tags, flexible batteries, etc.

conclusion

The innovation and development of PI gold-plated film technology is a microcosm of the continuous exploration and progress in the field of materials science. From improvementThin film gold plating processEvery step forward in PI gold plating technology has injected new vitality into the development of the electronics industry, expanding the application scope of conductive materials and shielding materials. In the future, with more breakthroughs in related technologies, we have reason to believe that PI gold plating film will play its unique role in a wider range of fields, promoting the development of electronic technology towards higher, faster, and stronger directions.

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