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Frontier News

Reasons and solutions for the decrease in conductivity of integrated circuit conductive silver paste in high temperature and high humidity environments

Time:2025-01-13Number:417

With the miniaturization and high performance of electronic devices, the application of integrated circuits (ICs) is becoming increasingly widespread. As an important material for connecting internal components of ICs, the performance stability of conductive silver paste under specific environmental conditions is crucial. This article will explore the solutions provided by Advanced Institute (Shenzhen) Technology Co., Ltd. in high temperature and high humidity environmentsResearch Platinum Brand YB6003 Integrated Circuit Conductive Silver AdhesivePossible issues of decreased conductivity and propose corresponding solutions.

1. Introduction

Conductive silver paste is an indispensable part of electronic packaging technology, which not only provides electrical connections, but also affects the reliability and service life of the entire circuit board to a certain extent. However, in some extreme working environments, such as high temperature and high humidity conditions, this material may experience a decline in conductivity, which can affect the stable operation of the entire system.导电银胶

2. Reasons for the decline in conductivity performance

2.1 Environmental factors

  • Humidity influence: In high humidity environments, moisture can penetrate intoConductive silver adhesiveInternally, it causes chemical or physical structural changes, leading to an increase in electrical resistivity.
  • Temperature effect: High temperatures accelerate the aging process of materials, reducing the bonding strength and conductivity of silver paste. In addition, temperature fluctuations may also cause thermal stress, which can have a destructive effect on the connection points.

2.2 Material Characteristics

  • Oxidation problem: Silver has good conductivity, but it is easily oxidized in humid air to form a layer of silver oxide, which is non-conductive and can affect the overall conductivity efficiency.
  • Component migration: Some organic components may evaporate or migrate to the surface at high temperatures, weakening the contact between silver particles and increasing interfacial resistance.导电银胶

3. Solution

3.1 Improve formula design

For the above reasons,Advanced Institute (Shenzhen) Technology Co., LtdThe R&D team can improve its weather resistance and anti-aging ability by optimizing the formula of YB6003. For example, adding appropriate amounts of antioxidants, moisture-proof agents, and other additives to delay the aging process of materials.

3.2 Improving the level of craftsmanship

  • Strictly control the coating thickness: ensure that each layer of conductive silver paste is evenly distributed to avoid negative effects caused by being too thick or too thin.
  • Optimize curing conditions: By adjusting the curing temperature and time parameters, the silver paste can be cured in the optimal state, improving its mechanical strength and electrical properties.

3.3 Strengthen protective measures

  • Adopting sealed packaging: reducing the impact of external environment on the finished product, especially for products stored for a long time.
  • Add protective coating: If necessary, a protective layer with good barrier properties can be applied on the outside of the conductive silver paste to prevent moisture from entering.导电银胶

4. Conclusion

By comparingResearch Platinum Brand YB6003 Integrated Circuit Conductive Silver AdhesiveThe study and analysis of the phenomenon of decreased conductivity in high temperature and high humidity environments have identified the main causes of the problem and proposed multiple effective improvement measures. These methods not only help improve the reliability of products, but also provide theoretical basis and technical support for the development of higher quality conductive silver adhesives in the future. At the same time, we also hope that more research and practice in the industry can promote the development of this field and contribute to the progress of the electronics industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
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