The material of PI gold-plated wrapping has a wide range of application prospects

In modern industry,electromagnetic shielding materialPlays a crucial role in the field of radio frequency and microwave. Among various materials, polyimide (PI) is widely used as a shielding material in electronic products, which has excellent high temperature resistance, chemical corrosion resistance, and good mechanical properties. In order to further improve the conductivity of PI materials, engineers often choose to coat PI materials with gold plating to achieve better grounding and shielding effects.

PI materials and their applications

Polyimide (PI) is a high-performance engineering plastic with excellent insulation performance, high temperature stability, chemical corrosion resistance, and excellent mechanical properties. Therefore, it has been widely used in aerospace, electronic communication, medical equipment and other fields. However, due to the good insulation performance of PI itself, it is necessary to increase its conductivity in certain application scenarios to achieve better shielding effect.

PI gold-plated wrapping process

PI gold-plated packageIt is a commonly used process that coats a layer of metal film on the surface of PI to give it good conductivity. The gold plating wrapping process mainly includes surface treatment, vacuum coating, and subsequent processing steps. Firstly, surface treatment is carried out on the PI surface to clean and remove surface dirt and grease, ensuring the adhesion between the gold plating layer and the PI substrate. Then, the processed PI material is placed in a vacuum coating equipment, and metal is deposited on the surface of the PI using methods such as thermal evaporation or magnetron sputtering in a vacuum environment to form a metal thin film. Finally, through subsequent processing techniques such as polishing, cleaning, etc., the surface of the gold-plated package is ensured to be flat and smooth, ensuring conductivity and shielding effect.

The advantages of PI gold-plated packaging

1. Improve conductivity: PI material itself has excellent insulation properties. Through gold plating wrapping process, its conductivity can be effectively improved, resistance can be reduced, and better shielding effect can be achieved.

2. Enhance the appearance texture: The PI material wrapped in gold has a metallic luster on the surface, which not only has good conductivity, but also improves the appearance texture and enhances the visual appeal of the product.

3. Enhance wear resistance: Metal coating can increase the hardness and wear resistance of PI materials, prolong their service life, and improve the stability and reliability of products.

Application Fields and Prospects

The material of PI gold-plated wrapping has a wide range of application prospects, and has important applications in aerospace, electronic communication, medical devices and other fields. With the continuous development of technology, the demand for electromagnetic shielding materials is also gradually increasing. PI gold-plated wrapping, as a high-performanceConductive shielding materialIt will be widely applied in the future. Meanwhile, with the continuous improvement and perfection of process technology, the production cost of PI gold-plated wrapping will gradually decrease, providing better conditions for its large-scale application.

In the future development, PI gold-plated packaging will continue to play an important role in providing a more comprehensive solution for the shielding effect of electronic products. With the continuous advancement of technology, we believe that PI gold-plated packages will beelectromagnetic shielding materialThe field shows greater potential and development space.