Ultra thin high conductivity gold-plated copper foil: an innovative choice for precision electronic components

In the modern electronics industry, as products develop towards miniaturization, lightweighting, and high performance, the requirements for key materials are also increasing.Ultra thin high conductivity gold-plated copper foilAs an emerging material, it is becoming an indispensable part of precision electronic component manufacturing due to its excellent conductivity, reliable mechanical strength, and excellent processing adaptability.Advanced Institute (Shenzhen) Technology Co., LtdExplore the basic characteristics, preparation methods, and enormous potential of this material in practical applications.

1、 Introduction to ultra-thin high conductivity gold-plated copper foil

Ultra thin high conductivity gold-plated copper foil usually refers to copper foil with a thickness between a few micrometers and tens of micrometers, whose surface is coated with a thin layer of gold through electroplating or other processes. Copper foil itself has good conductivity and ductility, while the gold layer provides the ability to resist corrosion and oxidation, while also ensuring good conductivity of the contact surface. This composite material isPrinted Circuit Board (PCB), Flexible Circuit Board (FPC)Touch panels and high-end batteries have a wide range of applications.

2、 Preparation process

1. Preparation of copper foil

The production of ultra-thin copper foil mainly adopts electrolytic or rolling methods. The copper foil produced by electrolysis has a relatively soft texture and is suitable for making multi-layer boards; The copper foil produced by rolling method has higher hardness and is more suitable for the production of single-layer boards. Regardless of the method, it is necessary to strictly control factors such as the thickness, surface flatness, and crystal structure of the copper foil to ensure the quality of the final product.

2. Gold plating treatment

After completing the copper foil preparation, the next step is to gold plate it. frequently-usedGold plating processIncluding electroplating, chemical plating, etc. During the electroplating process, copper foil is placed as a cathode in an electrolyte containing gold salts. Under the action of a DC power source, gold ions are reduced and deposited on the surface of the copper foil; Chemical plating uses a reducing agent to directly reduce gold ions in a solution to metallic gold, which is deposited on copper foil. Both methods can obtain a uniform and dense gold layer, improving the overall performance of copper foil.

3、 Product features and advantages

• High conductivity: Copper itself is an excellent conductor, and the addition of a gold layer further enhances the material's conductivity, making it suitable for applications that require high current density transmission.
• Good corrosion resistance: The gold layer has excellent chemical stability, which can protect copper foil from corrosion in harsh environments and extend its service life.
• Excellent weldability: Due to the gold plating on the surface, this material performs well during the welding process and can achieve stable and reliable electrical connections.
• Flexibility: Despite being gold-plated, ultra-thin copper foil still maintains a certain degree of flexibility, making it easy to process into various complex shapes.

4、 Application Fields

Ultra thin high conductivity gold-plated copper foil plays an important role in multiple high-tech fields due to its unique properties:

• Electronic component packaging: As a key material in high-performance integrated circuits (ICs) and chip packaging, it ensures efficient and stable signal transmission.
• Flexible circuit board: In FPC manufacturing, its flexibility and conductivity are utilized to design lightweight and portable electronic products.
• Touch technology: In the production of touch screens, as the basic material of the sensing layer, it improves the response speed and accuracy of the device.
• New energy battery: Used as a current collector for lithium-ion batteries, it helps to improve the energy density and cycle life of the battery.

In short,Ultra thin high conductivity gold-plated copper foilWith its outstanding performance and wide applicability, it has become an important force driving the continuous progress of the electronics industry. With the continuous innovation and development of technology, it is believed that more innovative applications based on such materials will emerge in the future, bringing more convenience and possibilities to human society.