Application and Technical Exploration of Copper Foil Tin Plating in Electronic Packaging Field

With the rapid development of the electronics industry, the demand for high-performance and high reliability electronic packaging materials is increasing day by day. Copper foil tin plating, as an important technological innovation, is gradually becoming a popular choice in the field of electronic packaging. This article will explore in detail the application of copper foil tin plating in the field of electronic packaging, and specifically mentionAdvanced Institute (Shenzhen) Technology Co., LtdContribution to tin plating technology on copper foil.

1、 Advantages of Copper Foil Tin Plating Technology

Tin plating on copper foil is achieved through advanced electroplating technology by depositing a thin layer of tin film on the surface of the copper foil. This technology brings multiple advantages:

1. Improved conductivity: Tin plated copper foil has significantly improved conductivity, reduced resistance, and decreased signal transmission loss. According to experimental data,Tin plated copper foilThe conductivity of the copper foil has increased by about 10% compared to untreated copper foil, providing strong support for high-speed and efficient electronic devices.
2. Enhanced corrosion resistance: The tin layer has good corrosion resistance and can effectively resist external environmental erosion of copper foil, extending the service life of electronic components.
3. Weldability improvement: Tin plated copper foil performs well in the welding process, significantly improving welding quality and efficiency, and reducing production costs.

2、 Application of Copper Foil Tin Plating in Electronic Packaging Field

1. Chip packaging

   • Copper wire bonding: Copper foil tin plating technology can replace traditional gold or aluminum wires for electrical connection between internal and external pins of chips. The conductivity of copper is about 85-95% of that of gold, but its cost is only about 1/10 of that of gold. Therefore, tin plated copper foil has become an ideal substitute for high performance and economy.
   • Inverted chip packaging: In inverted chip packaging, tin plated copper foil is used to make electrodes and micro bumps, which are directly soldered onto the substrate to achieve efficient signal and power transmission through copper materials with high thermal conductivity and low resistance.

2. printed-circuit board

   • High density wiring: With the development of printed circuit boards towards high density, tin plated copper foil has become an important material in multi-layer board manufacturing due to its excellent conductivity and corrosion resistance.
   • Enhancement of interlayer adhesion: Pure tin layers obtained through electroplating or chemical tin plating technology can effectively improve the interlayer adhesion of printed circuit boards, ensuring the integrity of signal transmission.

3. system-in-package

   • Internal connection circuit: In system level packaging, copper foil tin plating is used to manufacture internal connection circuits and as a current conduction path. This application requires copper foil to have extremely high conductivity and thin layer properties in order to achieve higher performance within limited packaging space.

4. thermal management

   • Radiators and hot channels:Copper foil tin platingDue to its excellent thermal conductivity, it is commonly used as a heat sink, heat channel, and in chip packagingThermal interface materialHelp quickly transfer the heat generated by the chip to the external heat dissipation structure.

3、 Copper foil tin plating technology of Advanced Institute (Shenzhen) Technology Co., Ltd

As a leading enterprise in the field of electronic packaging, Advanced Institute (Shenzhen) Technology Co., Ltd. is committed to the research and application of copper foil tin plating technology. The company has a professional R&D team that has successfully developed high-performance copper foil tin plated products through continuous technological innovation and R&D investment.

• Technological innovation: Advanced Institute Technology's copper foil tin plating technology adopts advanced electroplating technology to ensure uniform and dense coating, improving the conductivity and corrosion resistance of copper foil.
• Product quality: The company strictly produces and tests according to international standards to ensure that every batch of copper foil tin plated products meets high-quality requirements.
• Market application: Advanced Institute Technology's copper foil tin plated products are widely used in the manufacturing of key components such as printed circuit boards, electronic connectors, and integrated circuit packaging, providing strong support for the development of the electronics industry.

4、 Conclusion

Copper foil tin plating technologyThe application prospects in the field of electronic packaging are broad. Tin plating on copper foil provides a new option for high-performance and high reliability electronic packaging materials by improving conductivity, enhancing corrosion resistance, and improving weldability. As a leader in this field, Advanced Institute (Shenzhen) Technology Co., Ltd. will continue to devote itself to the research and innovation of copper foil tin plating technology, and contribute more to the development of the electronics industry.

With the rapid development of the global electronics industry, the demand for high-performance copper foil materials will continue to grow. Copper foil tin plating technology, as a new and high-performance material, is gradually becoming the darling of the market. In the future, with the continuous upgrading and improvement of electroplating technology, the application fields of copper foil tin plating will become more extensive, making greater contributions to human technological progress and the improvement of quality of life.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.