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With the increasing global awareness of environmental protection, traditional solvent based conductive adhesives are restricted due to the emission of volatile organic compounds (VOCs).Solvent-free conductive adhesiveAs an environmentally friendly material, it has gradually become a new favorite in the field of electronic connections due to its solvent-free, low VOC emissions, and good performance. Advanced Institute Technology will explore the preparation technology, performance characteristics, and application in electronic connections of solvent-free conductive adhesives.
The preparation technology of solvent-free conductive adhesive mainly involves the following steps:
1.1 Selection and treatment of conductive fillers
Conductive filler is a key component of solvent-free conductive adhesive, and materials with good conductivity such as silver powder and copper powder are usually selected. In order to improve the adhesion between the filler and the resin matrix, it is necessary to perform surface treatment on the conductive filler, such as modifying it with coupling agents.
1.2 Selection of resin matrix
The resin matrix is the basis for the adhesion and conductivity of solvent-free conductive adhesives. Epoxy resin is widely used due to its excellent mechanical properties and adhesive strength.
1.3 Mixing and Curing
Will be processedconductive fillerMix with the resin matrix, add an appropriate amount of curing agent and accelerator to ensure that the conductive filler is evenly dispersed in the matrix. Curing is carried out through methods such as thermal curing or photopolymerization to form solvent-free conductive adhesive.
The performance characteristics of solvent-free conductive adhesive are mainly reflected in the following aspects:
2.1 Solvent free and low VOC emissions
The solvent-free conductive adhesive does not contain organic solvents during preparation and use, reducing VOC emissions and meeting environmental requirements.
2.2 Good conductivity
By selecting appropriate conductive fillers and optimizing the formula,Solvent-free conductive adhesiveCan provide good conductivity to meet the needs of electronic connections.
2.3 Excellent adhesive strength
The selection of resin matrix and optimization of curing process make solvent-free conductive adhesive have excellent bonding strength and can firmly bond various materials.
2.4 Good heat resistance and chemical resistance
Solvent free conductive adhesive has good heat resistance and chemical resistance, and can work stably in high temperatures and harsh environments.
The application of solvent-free conductive adhesive in electronic connections mainly includes the following aspects:
3.1 Assembly of electronic components
During the assembly process of electronic components, solvent-free conductive adhesives can be used for chip bonding, wire bonding, etc., providing stable conductive connections.
3.2 Circuit board manufacturing
In circuit board manufacturing, solvent-free conductive adhesive can be used for lamination, bonding, and protection of circuit boards, improving their stability and reliability.
3.3 Sensors and actuators
In the manufacturing of sensors and actuators, solvent-free conductive adhesives can be used for bonding and protecting sensitive components, improving equipment accuracy and lifespan.
With the increasingly strict environmental regulations and the increasing demand for green materials in the electronics industry, the application prospects of solvent-free conductive adhesives are broad. Future research may focus on improving the comprehensive performance of conductive adhesives, reducing costs, and developing new application areas.
conclusion
Solvent free conductive adhesive as a green and environmentally friendlyElectronic connection materialsNot only does it provide new possibilities for the design and manufacturing of electronic products, but it also promotes the sustainable development of electronic connectivity technology. With the continuous progress of materials science, solvent-free conductive adhesives will play an increasingly important role in the field of electronic connections.
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