High temperature lead-free ruthenium paste with low TCR value: principle, preparation and application

1、 Introduction

In the field of electronic materials, high-temperature lead-free ruthenium paste is a special type of materialresistor pasteDue to its low TCR (temperature coefficient resistivity) value and excellent performance, it has attracted much attention. Especially in high-power density heating devices, high-temperature lead-free ruthenium paste with low TCR value is widely used for printing resistance patterns on substrates such as ceramics and stainless steel due to its good stability and small resistance changes.

2、 Principle of Low TCR High Temperature Lead free Ruthenium Paste

TCR value is a physical quantity that describes the variation of material resistivity with temperature. For high temperaturesLead-free ruthenium pasteIn terms of its low TCR value, it is mainly due to its special material ratio and preparation process. The slurry is mainly composed of glass powder, ruthenium oxide powder, organic phase, and additives. Through precise proportioning and preparation process, low sensitivity of resistivity to temperature changes is achieved.

3、 Preparation method and process

1. Preparation of glass powder: As the matrix material for high-temperature lead-free ruthenium slurry, the quality of glass powder has a significant impact on the performance of the final product. During the preparation process, it is necessary to control parameters such as composition, particle size, and distribution.

2. Preparation of organic phase: The organic phase is an important component of high-temperature lead-free ruthenium slurry, and its main function is to provide fluidity and wettability of the slurry. Suitable organic solvents and additives need to be selected during the preparation process to ensure the stability and printing performance of the slurry.

3. Preparation of slurry: Mix glass powder, ruthenium oxide powder, organic phase, and additives in a certain proportion to form a high-temperature lead-free ruthenium slurry. During the preparation process, it is necessary to control parameters such as mixing time and temperature to ensure the uniformity and stability of the slurry.

4. Screen printing and sintering: The prepared high-temperature lead-free ruthenium paste is coated on the surface of ceramics, stainless steel and other substrates through screen printing and other methods, and then subjected to sintering treatment. During the sintering process, it is necessary to control parameters such as temperature and time to ensure the quality and performance of the resistance pattern.

4、 Application and advantages

High temperature with low TCR valueLead-free ruthenium pasteMainly used for printing resistance patterns on the surface of substrates such as ceramics and stainless steel, especially suitable for high-power density heating devices. Its advantages lie in its low temperature dependent resistivity, good stability, and minimal resistance variation, which can meet the requirements of high precision and high reliability. Meanwhile, due to the absence of harmful substances such as lead in the slurry, it meets environmental requirements and has broad application prospects.

5、 Conclusion

Low TCR valuesHigh temperature lead-free ruthenium pasteAs a specialresistor pasteIt has broad application prospects in the field of electronic materials. By finely proportioning materials and controlling the preparation process, it is possible to achieve low TCR values and excellent performance. With the continuous development of electronic technology, the demand for high-performance resistor paste will continue to increase, and high-temperature lead-free ruthenium paste with low TCR value is expected to be widely used in the future.