Attention to the sequence of additive addition in the manufacturing process of low-temperature sintered solder copper paste

In the electronic manufacturing industry, low-temperature sintered solder copper paste is highly favored due to its excellent conductivity, oxidation resistance, and good soldering performance. Advanced Institute (Shenzhen) Technology Co., Ltd., as a leading enterprise in the industry, has received high praise in the market for its research and development of YB1099 low-temperature sintered solder copper paste. This article will delve into the topic ofYB1099 low-temperature sintered solder copper pasteThe emphasis on the order of additive addition during the manufacturing process is aimed at providing valuable reference for relevant practitioners.

The Manufacturing Basis of Low Temperature Sintering Solder Copper Paste

The manufacturing of low-temperature sintered solder copper paste is a complex and delicate process, involving precise proportioning and mixing of various raw materials and additives. These additives not only affect the conductivity, oxidation resistance, and sintering performance of copper paste, but also directly affect the quality and stability of the final product. Therefore, the order of adding additives has become a crucial step in the manufacturing process that cannot be ignored.

The importance of the order in which additives are added

existYB1099 low-temperature sintered solder copper pasteThe order in which additives are added during the manufacturing process has a significant impact on the performance of the product. A reasonable order of addition can ensure sufficient reaction and uniform dispersion between each component, thereby improving the overall performance of copper paste. On the contrary, if the order of addition is improper, it may lead to incompatibility or insufficient reaction between components, thereby affecting the conductivity, oxidation resistance, and sintering performance of copper paste.

Specific considerations for the order of adding additives

1. Mixing of reducing agent and copper salt: The manufacturing process usually begins with the mixing of reducing agent and copper salt. This step requires ensuring that the reducing agent is completely dissolved in deionized water, then slowly adding copper salt and stirring thoroughly until completely dissolved. This sequence helps to form a uniform solution, laying the foundation for subsequent copper particle addition.

2. Addition of copper particles and pH adjustment: Add copper particles to a mixture of reducing agent and copper salt, and stir evenly. Subsequently, pH adjustment is carried out to promote the formation of copper particle composites protected by nano hydrogenated cuprous oxide. The key to this step is to control the addition speed and stirring intensity of copper particles to ensure uniform dispersion of copper particles in the solution.

3. Cleaning and drying: After the reaction, the solution needs to be washed with water and acetone or ethanol until the pH becomes neutral, and then dried to obtain a copper particle composite coated with nano hydrogenated cuprous oxide. The cleaning process helps to remove impurities and unreacted substances, and improve the purity of copper paste.

4. Small molecule organic carboxylic acid treatment: In order to further improve the antioxidant and stability of copper paste, small molecule organic carboxylic acids need to be added to the prepared composite for surface modification and treatment. This step should be carried out after the copper paste is completely dried to ensure that small molecule organic carboxylic acids can evenly cover the surface of copper particles.

5. Addition of resin, solvent, and other additives: Finally, resin, solvent, and other additives (such as curing agents, antioxidants, etc.) are added to the treated composite and thoroughly mixed to obtain the final productYB1099 low-temperature sintered solder copper pasteThe order and proportion of these additives should be adjusted according to the specific formula to ensure that the various properties of the copper paste reach the optimal state.

Practical Experience of Advanced Institute (Shenzhen) Technology Co., Ltd

As a leading enterprise in the industry,Advanced Institute (Shenzhen) Technology Co., LtdWe have accumulated rich practical experience in the manufacturing process of YB1099 low-temperature sintered solder copper paste. The company focuses on the selection of raw materials and the optimization of additive addition sequence. Through continuous research and innovation, it has successfully improved the conductivity, oxidation resistance, and sintering performance of copper paste. At the same time, the company has established a sound quality management system and after-sales service system to ensure that customers can obtain high-quality products and excellent services.

conclusion

The order of adding additives is a crucial step that cannot be ignored in the manufacturing process of low-temperature sintered solder copper paste. A reasonable order of addition can ensure sufficient reaction and uniform dispersion between each component, thereby improving the overall performance of copper paste. Advanced Institute (Shenzhen) Technology Co., Ltd. has achieved significant results in the manufacturing of YB1099 low-temperature sintered solder copper paste with its rich practical experience and continuous innovation spirit, making important contributions to the development of the electronic manufacturing industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.