Conductive gold paste for low-temperature co fired ceramics: technology and application

Low temperature co fired ceramics (LTCC) technology, as an important branch of modern electronic packaging technology, has received widespread attention for its excellent high-frequency characteristics, low thermal expansion coefficient, and the ability to be processed into three-dimensional complex structures. In LTCC technology,Drilled conductive gold pasteAs a key material for connecting different layers and achieving electrical conductivity, its performance directly affects the performance of LTCC substrates and even the entire electronic device.

1、 Composition and characteristics of conductive gold paste filled with holes

The conductive gold paste for filling holes is mainly composed of high-purityGold powderComposed of inorganic additives, carriers, adjuvants, and solvents. Among them, the accurate control of the particle size distribution and content of gold powder as the conductive main body is the key to ensuring the conductivity of the gold paste. The addition of inorganic additives and additives can enhance the bonding strength between the gold paste and the LTCC substrate, and improve the chemical bonding effect during the sintering process. The selection of solvents is related to the fluidity, stability, and processability of the gold paste.

2、 Preparation technology of conductive gold paste for filling holes

Irrigation holeConductive gold pasteThe preparation technology of gold powder involves multiple steps such as grinding, mixing, stirring, and filtering. Among them, the grinding and mixing of gold powder need to be accurately controlled to ensure the uniform distribution and consistency of particle size of the gold powder. The stirring and filtering process can further improve the uniformity and stability of the gold paste. In addition, advanced dispersion techniques have also been applied in the preparation process of gold paste to ensure uniform dispersion of gold powder in the paste and improve the conductivity of the gold paste.

3、 The application prospects of conductive gold paste filled with holes

With the rapid development of technologies such as 5G and the Internet of Things, the demand for high-performance electronic devices continues to grow. LTCC technology, with its unique advantages, has shown broad application prospects in these fields. As a key material in LTCC technology, the optimization and improvement of the performance of conductive gold paste filled with holes are of great significance for improving the performance and reliability of LTCC substrates.

Specifically, the excellent performance of through-hole conductive gold paste has made it widely used in high-performance electronic devices such as high-frequency filters, antennas, and sensors. For example, in high-frequency filters, filling holes with conductive gold paste can achieve efficient electrical connections between different layers, improving the performance of the filter; In the antenna,Drilled conductive gold pasteThis can ensure stable transmission of antenna signals and improve antenna performance.

4、 Conclusion

Filling holes in low-temperature co fired ceramicsConductive gold pasteAs a key material for connecting different layers and achieving electrical conductivity, optimizing and improving its performance is of great significance for improving the performance and reliability of LTCC substrates. With the continuous advancement of technology and innovation in preparation techniques, it is believed that the performance of conductive gold paste for hole filling will be further improved in the future, injecting new vitality into the development of LTCC technology.