Adhesion Enhancement Technology of Low Temperature Conductive Copper Paste at Low Temperature

With the rapid development of modern electronic technology, low-temperature conductive copper paste is increasingly widely used in fields such as electronic packaging, flexible electronics, wearable devices, and solar cells. However, under low temperature conditions, the adhesion of conductive copper paste has always been a key factor affecting its performance and application range. This article will explore how to enhance the adhesion of low-temperature conductive copper paste at low temperatures by optimizing the formula, microstructure, and preparation process, and present the findings of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB5106 Low Temperature Conductive Copper PasteProvide an example for illustration.

1、 Formula optimization

1. Selection of high-performance resins

Choosing resins with excellent low-temperature stability and adhesion as binders is crucial for improving the adhesion of low-temperature conductive copper paste. The YB5106 low-temperature conductive copper paste from Yanbo brand adopts a specially designed high-performance resin, which can maintain good physical and chemical stability at low temperatures, ensuring a good bond between the copper paste and the substrate. Experimental data shows that the addition of this resin increases the adhesion of copper paste by about 25% in a low-temperature environment of -40 ℃.

2. The function of additives

Adding appropriate amounts of functional additives such as coupling agents, dispersants, etc. can significantly improve the dispersibility and wettability of copper paste, thereby enhancing its adhesion. The additives in the YB5106 low-temperature conductive copper paste of Yanbo brand have been carefully screened and proportioned to effectively promote the bonding between copper powder and resin at low temperatures, further enhancing adhesion. Experimental results have shown that the addition of these additives increases the adhesion of copper paste by about 15%.

2、 Microstructure optimization

1. Copper powder morphology and particle size control

The shape and particle size of copper powderLow temperature conductive copper pasteThe adhesion force has a significant impact. By optimizing the morphology (such as flake, spherical, etc.) and particle size distribution of copper powder, the contact area between copper powder and substrate and resin can be increased, thereby improving adhesion. The YB5106 low-temperature conductive copper paste from Yanbo brand uses carefully selected copper powder, which effectively controls its morphology and particle size, resulting in a significant improvement in the adhesion of the copper paste at low temperatures.

2. Microstructure regulation

By adjusting the preparation process, such as using ultrasonic dispersion, high-speed stirring and other methods, the microstructure of copper paste can be optimized to make it more uniform and dense. This structural optimization helps to enhance the bonding force between copper paste and substrate, thereby improving adhesion. Experimental data shows that the low-temperature conductive copper paste YB5106 from Yanbo brand, which has been microstructure controlled, has an increased adhesion force of about 10%.

3、 Optimization of preparation process

1. Curing process adjustment

The curing temperature and curing time are key factors affecting the adhesion of low-temperature conductive copper paste. By adjusting the curing process parameters, such as lowering the curing temperature and extending the curing time, the resin in the copper paste can be fully cured, thereby improving the adhesion. Experiments have found that when the curing temperature is 180 ℃ and the curing time is 30 minutes, the adhesion of YB5106 low-temperature conductive copper paste from Yanbo brand reaches its optimal state.

2. Surface treatment technology

Surface treatment of copper powder, such as chemical plating, physical vapor deposition, etc., can improve the surface activity of copper powder, thereby enhancing its bonding strength with resin and substrate. Experimental data shows that copper powder prepared by surface treatmentResearch Platinum Brand YB5106 Low Temperature Conductive Copper PasteThe adhesion at low temperatures has increased by about 30%.

4、 Application examples of YB5106 low-temperature conductive copper paste from Yanbo brand

YB5106 low-temperature conductive copper paste from Yanbo brand has been widely used in various fields due to its excellent conductivity and adhesion. For example, in the field of flexible electronics, this copper paste is used to prepare devices such as flexible circuit boards and flexible sensors, and its good flexibility and stretchability can meet the special needs of flexible electronic devices. In the field of solar cells, this copper paste is used to prepare electrodes for solar cells, improving the conversion efficiency and stability of the cells. In addition, in the fields of wearable devices, LED packaging, etc., the YB5106 low-temperature conductive copper paste from Yanbo brand has also shown broad application prospects.

5、 Conclusion

By optimizing the formula, microstructure, and preparation process, significant enhancement can be achievedLow temperature conductive copper pasteAdhesion at low temperatures. As a star product of Advanced Institute (Shenzhen) Technology Co., Ltd., YB5106 low-temperature conductive copper paste from Yanbo brand has been widely used in multiple fields due to its excellent conductivity and adhesion. In the future, with the continuous development of electronic technology, the application prospects of low-temperature conductive copper paste will be even broader.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.