How to use LCP film gold plating technology to improve the electromagnetic compatibility of electronic devices

1、 Introduction

2、 Characteristics of LCP film

LCP (Liquid Crystal Polymer) films possess a range of outstanding properties. It has an extremely low dielectric constant and loss factor, which enables it to effectively reduce the propagation loss of electromagnetic waves in the high frequency range. At the same time, LCP film also has excellent thermal stability, mechanical strength, and chemical stability, which can adapt to complex electronic device working environments. Whether it is the heat dissipation area of electronic components in high-temperature environments or electronic devices in industrial production environments where chemical substances may exist, LCP film can maintain its stable performance, laying a good foundation for the improvement of electromagnetic compatibility.

3、 Principle and Process of LCP Thin Film Gold Plating Technology

1. Gold plating principle
   • Gold plating is the formation of a continuous and uniform gold film on the surface of LCP thin film. Gold fittings have good conductivity and chemical stability, and can construct an efficient electromagnetic shielding layer on the surface of LCP films. When electromagnetic waves are incident on the surface of a gold-plated LCP film, the free electrons in the gold film will move under the action of the electromagnetic wave electric field, forming induced current. According to Lenz's law, this induced current generates a magnetic field opposite to the direction of the incident electromagnetic wave magnetic field, which reflects and attenuates the incident electromagnetic wave, effectively preventing the penetration of the electromagnetic wave, thereby improving the electromagnetic shielding effect of electronic devices and enhancing electromagnetic compatibility.
2. Gold plating process
   • Advanced Institute (Shenzhen) Technology Co., LtdThe LCP film gold plating process usually includes key steps such as film pretreatment, pre coating cleaning, and gold plating deposition. During the film pretreatment stage, the LCP film will undergo surface activation treatment to enhance its adhesion with the gold plating layer. For example, by using plasma treatment technology to introduce active groups on the surface of thin films, their surface energy can be improved. Pre coating cleaning uses precise cleaning techniques to remove impurities, dust, and oil stains from the surface of the film, ensuring the adhesion and uniformity of the gold plating layer. During the gold plating process, advanced techniques such as physical vapor deposition (PVD) or chemical plating are often used to precisely control the thickness, density, and uniformity of the gold plating layer. Taking physical vapor deposition as an example, gold atoms are evaporated and deposited on the surface of LCP thin films in a vacuum environment. By controlling parameters such as evaporation rate, deposition time, and substrate temperature, precise control of the quality of the gold plating layer is achieved.

4、 The Enhancement Effect of LCP Thin Film Gold Plating Technology on Electromagnetic Compatibility

1. Enhancement of shielding effectiveness
   • The gold-plated LCP film can significantly improve its shielding effectiveness against electromagnetic waves. In the low frequency range, the high conductivity of gold film makes its shielding effect on magnetic fields particularly obvious, which can effectively block the interference of external low-frequency magnetic fields on the internal circuits of electronic devices. In the high frequency range, due to the synergistic effect of the gold film and LCP film, on the one hand, the LCP film reduces the propagation loss of electromagnetic waves, and on the other hand, the gold film reflects and attenuates electromagnetic waves. The combined effect of the two greatly broadens the shielding frequency band, improves the overall shielding efficiency, reduces the electromagnetic coupling between the internal and external of electronic devices, and thus enhances electromagnetic compatibility.
2. Signal integrity protection
   • Within electronic devices, high-speed signal transmission lines are susceptible to electromagnetic interference, leading to signal distortion or errors.LCP film gold platingTechnology can provide a good electromagnetic shielding environment for these signal transmission lines. The shielding effect of the gold film can prevent external electromagnetic waves from interfering with high-speed signals, while also avoiding crosstalk between internal signals. For example, in multi-layer circuit board design, using gold-plated LCP film as interlayer isolation material can effectively isolate electromagnetic signals between different layers, ensure the integrity of signals during transmission, ensure the normal operation of electronic devices and the accuracy of data transmission, which is of great significance for improving electromagnetic compatibility.

5、 Application Cases and Practical Experience

6、 Conclusion

LCP thin film gold plating technologyWith the excellent characteristics of LCP film and the electromagnetic shielding function of the gold plating layer, it provides an efficient and reliable solution for improving the electromagnetic compatibility of electronic devices. The research and practical achievements of Advanced Institute (Shenzhen) Technology Co., Ltd. in this technology field have provided valuable technical support and practical experience for the electronic equipment manufacturing industry in addressing electromagnetic compatibility challenges. With the continuous development of electronic technology, further in-depth research and optimization of LCP thin film gold plating technology will play a more important role in improving electronic device performance and ensuring electromagnetic environment safety.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.