Performance of PI Gold Plated Film as Electrode Material in Electrochemical Reactions

Polyimide (PI) gold plating film, as a high-performance composite material, exhibits unique advantages in electrochemical reactions due to its excellent conductivity, heat resistance, and good chemical stability. This article will explorePI gold-plated filmAs an electrode material, its performance in electrochemical reactions is analyzed in detail based on research data and experimental results from Advanced Institute (Shenzhen) Technology Co., Ltd., including key properties such as conductivity, heat resistance, and electromagnetic shielding effectiveness.

Basic characteristics of PI gold-plated film

PI materials have excellent thermal stability, mechanical strength, chemical inertness, and good insulation properties, which enable them to maintain stable performance in extreme environments such as high temperature, high humidity, and strong electromagnetic fields. The gold plating layer, as a precious metal coating, has extremely high conductivity and good corrosion resistance. Coating a layer of gold on the surface of PI material can not only significantly improve its conductivity, but also effectively prevent its performance from deteriorating in harsh environments such as humidity and corrosion.

Research data and experimental results

1. Conductivity

Advanced Institute (Shenzhen) Technology Co., LtdThe experimental data shows that the conductivity of PI gold plating film is excellent, and its surface resistivity is usually 1-10 Ω/sh. This high conductivity enables the PI gold plating film to provide stable and efficient current transfer in electrochemical reactions. By comparing the effects of different preparation processes (such as magnetron sputtering and electroplating) on the conductivity of PI gold plating films, the sheet resistance of PI gold plating films prepared by magnetron sputtering process can reach below 0.1 Ω/□, while the sheet resistance prepared by electroplating process is about 0.2-0.3 Ω/□. This indicates that the magnetron sputtering process performs better in terms of conductivity.

2. Heat resistance performance

The PI gold-plated film has good heat resistance, and its glass transition temperature can reach around 350 ℃. In high temperature environments, the adhesion between copper foil and polyimide film will be further enhanced, greatly improving the stability of the conductive film and reducing the occurrence of conductive layer peeling. Meanwhile, the high temperature during the welding process will not significantly reduce the conductivity. This characteristic enables the PI gold plating film to maintain stable performance under high temperature conditions during electrochemical reactions.

3. Electromagnetic shielding effectiveness

Electromagnetic shielding effectiveness (SE) is a key indicator for measuring a material's ability to attenuate electromagnetic waves. The experimental results of Advanced Institute (Shenzhen) Technology Co., Ltd. show that the SE value of PI gold-plated film in the frequency range of 10MHz to 3GHz is as high as 70dB or more, significantly better than the average SE value of traditional copper plates (about 50dB). This indicates thatPI gold-plated filmHas superior electromagnetic shielding performance in the high frequency range. In 5G and future 6G wireless communication systems, PI gold plating film has become an ideal choice for improving the signal integrity of communication equipment and reducing electromagnetic interference due to its low surface impedance (0.02 Ω) and excellent shielding effectiveness.

Application of PI Gold Plating Film in Electrochemical Reactions

PI gold-plated film asElectrode materialIt has broad application prospects in electrochemical reactions. Its high conductivity, excellent heat resistance, and good electromagnetic shielding effectiveness enable the PI gold plating film to maintain stable performance in complex electrochemical environments. For example, in electrochemical energy storage devices such as fuel cells, lithium-ion batteries, and supercapacitors, PI gold plating film can be used as an electrode material to provide efficient and stable current transfer and charge transfer. In addition, PI gold plating film can also be used to make small electronic components such as inductors, capacitors, and resistors, as well as engine management systems, body control systems, and entertainment systems in automotive electronic devices.

conclusion

In summary, PI gold-plated film, as a high-performance composite material, exhibits excellent performance in electrochemical reactions. Its high conductivity, excellent heat resistance, and good electromagnetic shielding performance make PI gold plating film an ideal choice for electrode materials. The research data and experimental results of Advanced Institute (Shenzhen) Technology Co., Ltd. further confirm the excellent performance of PI gold plating film in electrochemical reactions. In the future, with the continuous advancement of technology and the increasingly perfect preparation technology, PI gold plating film is expected to demonstrate its unique advantages and huge application potential in more fields.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.